メインコンテンツに移動
CMOS Hex D-Type Flip-Flop

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:SBDIP
Pkg. Code:DAV
Lead Count (#):16
Pkg. Dimensions (mm):20.32 x 7.49 x 2.41
Pitch (mm):2.54

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeSBDIP
Lead Count (#)16
Carrier TypeTube
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)2.5
Pkg. Dimensions (mm)20.3 x 7.5 x 2.41
DLA SMD5962R9660501VEC
Pb (Lead) FreeExempt
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ25
Temp. Range (°C)-55 to +125°C
DSEE (MeV·cm2/mg)75
Length (mm)20.3
Qualification LevelQML Class V (space)
RatingSpace
TID HDR (krad(Si))100
TID LDR (krad(Si))ELDRS free
Thickness (mm)2.41
Width (mm)7.5

説明

The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W.