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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
32K x 18 SuperSync FIFO, 3.3V

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PP64
Lead Count (#):64
Pkg. Dimensions (mm):10.0 x 10.0 x 1.4
Pitch (mm):0.5

環境及び輸出分類情報

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

製品スペック

Lead Count (#)64
Pb (Lead) FreeNo
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)512
Family NameSuperSync
I/O Frequency (MHz)50 - 50
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)10
MOQ500
Organization32K x 18
Package Area (mm²)100
Pb Free Categorye0
Pitch (mm)0.5
Pkg. Dimensions (mm)10.0 x 10.0 x 1.4
Pkg. TypeTQFP
Qty. per Carrier (#)0
Qty. per Reel (#)500
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)10

説明

The 72V275 is a 32K x 18 SuperSync FIFO memory with clocked read and write controls. It's a functionally compatible version of the 72275 designed to run off a 3.3V supply for very low power consumption. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.