メインコンテンツに移動
16K x 9 SuperSync FIFO, 3.3V

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PPG64
Lead Count (#):64
Pkg. Dimensions (mm):10.0 x 10.0 x 1.4
Pitch (mm):0.5

環境及び輸出分類情報

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

製品スペック

Lead Count (#)64
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureUni-directional
Bus Width (bits)9
Core Voltage (V)3.3
Density (Kb)144
Family NameSuperSync
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)10
MOQ80
Organization16K x 9
Package Area (mm²)100
Pb Free Categorye3 Sn
Pitch (mm)0.5
Pkg. Dimensions (mm)10.0 x 10.0 x 1.4
Pkg. TypeTQFP
Price (USD)$71.64013
Qty. per Carrier (#)160
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)10
掲載No

説明

The 72V261 is a 16K x 9 SuperSync FIFO memory with clocked read and write controls. It's a functionally compatible version of the 72261 designed to run off a 3.3V supply for very low power consumption. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperSync family.)