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256K x 18 / 512K x 9 SuperSync II FIFO, 3.3V

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BCG100
Lead Count (#):100
Pkg. Dimensions (mm):11.0 x 11.0 x 1.4
Pitch (mm):1

環境及び輸出分類情報

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

製品スペック

Lead Count (#)100
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyPHILIPPINES
Country of Wafer FabricationTAIWAN, USA
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)4096
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)133 - 133
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)11
MOQ50
Organization256K x 18, 512K x 9
Package Area (mm²)121
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)11.0 x 11.0 x 1.4
Pkg. TypeCABGA
Price (USD)$239.9696
Qty. per Carrier (#)168
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)11
掲載No

説明

The 72V2113 512K x 9/256K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.