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Renesas Electronics Corporation

Features

  • Digital compensation of sensor offset, sensitivity, temperature drift, and non-linearity
  • Supports differential sensor signal spans from 3mV/V to 105mV/V
  • Internal temperature compensation and detection via a bandgap proportional to absolute temperature (PTAT)
  • Optional sequential output of both temperature and bridge readings through the ZACwire™ digital output
  • Output options: ratiometric analog voltage, absolute analog voltage, or ZACwire digital one-wire interface (OWI)
  • Supply voltage range: 2.7V to 5.5V; 5.5V to 30V with an external JFET
  • Current consumption: 0.25mA to 1mA, depending on the adjusted sample rate
  • Wide operating temperature range: -50°C to +150°C
  • Fast response time: 1ms
  • High-voltage protection up to 30V with an external JFET
  • Buffered and chopper-stabilized output DAC

Description

The ZSC31010 is a CMOS integrated circuit that enables easy and precise calibration of resistive bridge sensors via EEPROM. When paired with a resistive bridge sensor, it digitally calibrates offset and gain, with the option to calibrate offset and gain coefficients as well as linearity over temperature. Second-order compensation can be enabled for the temperature coefficients of gain, offset, or bridge linearity.

The ZSC31010 communicates with a host computer via the Renesas ZACwire™ serial interface and can be easily mass-calibrated in a Windows® environment. Once calibrated, the SIG™ pin can provide a selectable 0 to 1V absolute analog output, a rail-to-rail ratiometric analog output, or a digital serial output of bridge data with optional temperature data.

Parameters

AttributesValue
FunctionResistive SSC
Automotive Qual.No
Supply Voltage (V)2.7 - 30
Input TypeSingle-bridge
InterfaceRatiometric Voltage, Absolute Voltage, ZACwire™
Adj. Analog Gain6 - 6, 12 - 12, 24 - 24, 48 - 48
Resolution (bits)14
Sample Rate Max (KHz)1
Temp. Range (°C)-40 to +85°C, -40 to 85°C, -50 to 150°C

Package Options

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
SOIC4.9 x 3.9 x 1.581.27
WAFER0.0 x 0.0 x 0.0

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