Features
- Phase jitter (12kHz to 20MHz): 55fs RMS (typ.) at 156.25MHz
- Package options:
- 1.8 × 1.4 × 0.85 mm (1.6 × 1.2 mm footprint compatible)
- 2.0 × 1.6 × 0.85 mm
- 2.5 × 2.0 × 0.7 mm
- 3.2 × 2.5 × 0.7 mm
- Factory programmable with up to three frequencies (from 50MHz to 1250MHz) and/or output types
- Output types: LVCMOS, LVDS, HCSL, LVPECL, CML
- Supply voltage: 1.8V, 2.5V or 3.3V
- Total stability (including temperature, power supply, and aging):
- ± 50ppm (2.5V, 3.3V)
- Operating temperatures: -40°C to +85°C
Description
The XK devices are a second-generation follow-on to the XF ProXO high-performance oscillators designed for high-performance applications and are often referred to as ProXO II. The XK family is optimized for communications applications requiring ultra-low jitter and is available in the industry’s smallest package. Each device can be factory programmed with up to 3 frequencies and/or output types.
The differential oscillator supports 20 commonly used networking frequencies from 50MHz to 1250MHz. It features 55fs RMS jitter (typ.), excellent immunity to power supply noise and environmental hazards, industry-standard package sizes down to 1.8 x 1.4 mm and operating temperature support from -40°C to 85°C.
Try the Custom Part Configuration Utility.
Parameters
| Attributes | Value |
|---|---|
| Function | XO |
| Output Type | HCSL, LVCMOS, LVDS |
| Output Freq Range (MHz) | 50 - 1250 |
| Supply Voltage (V) | 1.8 - 1.8, 3.3 - 3.3 |
| Phase Jitter Max RMS (ps) | 0.055 |
| Freq. Stability Total (± PPM) | 30, 50 |
| Temp. Range (°C) | -40 to 85°C |
| Product Category | Crystal Oscillators |
Try the Custom Part Configuration Utility.
| Part Number | Status | Samples | Longevity | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Output Freq (MHz) | Pitch (mm) | Pkg. Dimensions (mm) | Output Type | Freq. Stability Total (± PPM) | Supply Voltage (V) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XK01H050H100H125I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 50MHz, 100MHz, 125MHz | 0.55mm | 1.4 x 1.8 x 0.85 | LVCMOS | 30± PPM | 1.8 - 1.8 | Yes | e3 Sn | -40 to 85°C |
| XK03L106L212L425I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 106.25MHz, 212.5MHz, 425MHz | 0.55mm | 1.4 x 1.8 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK03L156L312L625I | Active | Available | 2040 Apr | Out of Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.55mm | 1.4 x 1.8 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK03L161L322L644I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 161.132813MHz, 322.265625MHz, 644.53125MHz | 0.55mm | 1.4 x 1.8 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK03R156R312R625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.55mm | 1.4 x 1.8 x 0.85 | HCSL | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK11H050H100H125I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 50MHz, 100MHz, 125MHz | 0.73mm | 2.0 x 1.6 x 0.85 | LVCMOS | 30± PPM | 1.8 - 1.8 | Yes | e3 Sn | -40 to 85°C |
| XK13L106L212L425I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 106.25MHz, 212.5MHz, 425MHz | 0.73mm | 2.0 x 1.6 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK13L156L312L625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.73mm | 2.0 x 1.6 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK13L161L322L644I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 161.132813MHz, 322.265625MHz, 644.53125MHz | 0.73mm | 2.0 x 1.6 x 0.85 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK13R156R312R625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.73mm | 2.0 x 1.6 x 0.85 | HCSL | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK21H050H100H125I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 50MHz, 100MHz, 125MHz | 0.9mm | 2.0 x 2.5 x 0.7 | LVCMOS | 30± PPM | 1.8 - 1.8 | Yes | e3 Sn | -40 to 85°C |
| XK23L106L212L425I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 106.25MHz, 212.5MHz, 425MHz | 0.9mm | 2.0 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK23L156L312L625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.9mm | 2.0 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK23L161L322L644I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 161.132813MHz, 322.265625MHz, 644.53125MHz | 0.9mm | 2.0 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK23R156R312R625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 0.9mm | 2.0 x 2.5 x 0.7 | HCSL | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK31H050H100H125I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 50MHz, 100MHz, 125MHz | 1.06mm | 3.2 x 2.5 x 0.7 | LVCMOS | 30± PPM | 1.8 - 1.8 | Yes | e3 Sn | -40 to 85°C |
| XK33L106L212L425I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 106.25MHz, 212.5MHz, 425MHz | 1.06mm | 3.2 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK33L156L312L625I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 1.06mm | 3.2 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK33L161L322L644I | Active | Available | 2040 Apr | In Stock | LGA | 6# | Cut Tape | 3 | 161.132813MHz, 322.265625MHz, 644.53125MHz | 1.06mm | 3.2 x 2.5 x 0.7 | LVDS | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
| XK33R156R312R625I | Active | Available | 2040 Apr | Out of Stock | LGA | 6# | Cut Tape | 3 | 156.25MHz, 312.5MHz, 625MHz | 1.06mm | 3.2 x 2.5 x 0.7 | HCSL | 50± PPM | 3.3 - 3.3 | Yes | e3 Sn | -40 to 85°C |
- Datasheet AddendumPDF 139 KB R31DS0198EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 138 KB R31DS0195EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 139 KB R31DS0196EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 137 KB R31DS0197EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 139 KB R31DS0199EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 138 KB R31DS0200EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 138 KB R31DS0201EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 139 KB R31DS0202EU0100 Rev.1.00 Nov 06, 2023
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- Datasheet AddendumPDF 139 KB R31DS0204EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 139 KB R31DS0194EU0100 Rev.1.00 Nov 03, 2023
- Datasheet AddendumPDF 138 KB R31DS0193EU0100 Rev.1.00 Nov 03, 2023
- Application NotePDF 158 KB R31AN0057EU0100 Rev.1.00 Jul 25, 2023AI-generated Summary: Layout recommendations focus on optimizing thermal dissipation for ProXO II devices by managing junction temperature through proper PCB design and operating conditions. Key techniques include using thermal vias connected to ground and power planes, placing devices centrally away from PCB edges and high-power components, employing wider and thicker solder traces, and using thicker PCBs to enhance heat spread. Power supply design emphasizes quiet, well-regulated sources with close bypass capacitors. Clamshell test sockets require caution due to limited thermal dissipation. Reference layouts specify copper plane areas and via configurations to maintain device junction temperatures within safe limits.
Recommended Documents (1)
- Datasheet AddendumPDF 139 KB R31DS0198EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 138 KB R31DS0195EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 139 KB R31DS0196EU0100 Rev.1.00 Nov 06, 2023
- Datasheet AddendumPDF 137 KB R31DS0197EU0100 Rev.1.00 Nov 06, 2023View More (13)
Datasheets (13)
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- Application NotePDF 158 KB R31AN0057EU0100 Rev.1.00 Jul 25, 2023AI-generated Summary: Layout recommendations focus on optimizing thermal dissipation for ProXO II devices by managing junction temperature through proper PCB design and operating conditions. Key techniques include using thermal vias connected to ground and power planes, placing devices centrally away from PCB edges and high-power components, employing wider and thicker solder traces, and using thicker PCBs to enhance heat spread. Power supply design emphasizes quiet, well-regulated sources with close bypass capacitors. Clamshell test sockets require caution due to limited thermal dissipation. Reference layouts specify copper plane areas and via configurations to maintain device junction temperatures within safe limits.
Application Notes & White Papers (1)
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Learn about how the ProXO2 family delivers the industry’s smallest package and uncompromised performance at 55fs typical phase jitter.
Support Communities
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Guiliani on Embedded World 2023, Nuremberg, Germany, March 14-16th, 2023
Hello global Guiliani friends! we are exhibiting next week in Nuremberg on the "Embedded World" trade show. Guiliani as well as our other cool technologies. Check out this short (1 minute) video: https://youtu.be/ucyCJ-Xkt0E Looking forward to see you in hall 3, stand 601 ...
Mar 8, 2023 -
Reverse engineering an air conditioner protocol
Hello, as probably not so few know, Renesas MCUs are rather popular with aircon companies. As of lately I had a need to reverse engineer a protocol in between blocks of a split system.It seem to use a very bizarre format: https://pastebin.com/xKn7Hs6P As ...
Sep 8, 2020 -
NX_DHCP_CLIENT_MAX_RECORDS
The only method I currently see for setting NX_DHCP_CLIENT_MAX_RECORDS is to add a a NetX Duo DHCP IPv4 Client in the Synergy Configuration tool of the project. I am looking for an alternative method of setting NX_DHCP_CLIENT_MAX_RECORDS to a value other than ...
Aug 3, 2019
Knowledge Base
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What is the flammability rating for your Crystal Oscillators?
Last Updated: 01/13/2026 Question: What is the flammability rating for your Crystal Oscillators? Answer: All these are hermetic packages. There is no classification for hermetic packages as they are non-flammable components. Suitable Products (XO): XK, XF, XT, XU, XL and XA
Jan 13, 2026 -
Crystal Oscillator Radiation Testing
... Question: Do you have radiation test reports for your crystal oscillators? Answer: As these are commercially rated devices, these do not undergo radiation qualifications and we cannot recommend them for use in space applications or other radiation environments. Suitable Products Crystal Oscillator Series XA, XF, XK, XL, XP, XT, XU
Mar 31, 2026 -
Can the Clock Oscillators, Quartz Crystal Oscillators be washed in the PCB assembly process.
Yes, all these family devices [ (XO): XK, XF, XT, XU, XL & XA ] are sealed and can go through the washing process.