Features
- Optimized for current resonance application
- Low collector to emitter saturation voltage VCE(sat) = 1.5V typ. (at IC = 30A, VGE = 15V, Ta = 25 °C)
- Built-in fast recovery diode in one package
- Trench gate and thin wafer technology
- High-Speed switching tf = 45ns typ. (at VCC = 400V, VGE = 15V , IC = 30A, Rg = 10Ω, Ta = 25 °C, Inductive load)
- Low tail loss Etail = 160μJ typ. (at VCC = 300V, VGE = 20V, IC = 50A, Rg = 15Ω, Tc = 125 °C, current resonance circuit)
Description
The RJH60T04DPQ-A1 600V, 30A trench insulated-gate bipolar transistor (IGBT) offers a low collector to emitter saturation voltage, built-in fast recovery diode (FRD), and can be used for current resonance circuit applications. It is available in a TO-247A package type.
Applications
- Current resonance circuit
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free |
|---|---|---|---|---|---|---|---|---|
| RJH60T04DPQ-A1#T0 | Obsolete | Available | In Stock | TO-247A | 3# | Tube | 1 | Yes |
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- Application NoteAI-generated Summary: The document outlines derating standards for Power MOSFETs and IGBTs, emphasizing temperature, humidity, voltage, current, and power limits to ensure device reliability. It discusses package type selection between hermetic sealed and plastic molded types, highlighting the advantages of surface-mount packages for miniaturization. It also details precautions for physical handling, including proper lead forming, cutting, and mounting techniques to prevent stress and damage during installation.
- Application NoteAI-generated Summary: The TO-247plus package differs from the TO-247 mainly by including screw holes while maintaining similar external dimensions and pin pitch, allowing easy board design compatibility. Heat dissipation is critical for IGBTs due to power generation; proper mounting torque (20-100 N) ensures stable thermal contact without damaging the device. Applying thermal grease significantly improves heat conduction by reducing thermal resistance by 1.8 times. The TO-247plus package offers better heat dissipation than TO-247 due to a larger chip mounting frame. Proper device handling during heatsink mounting prevents damage such as resin chipping or internal cracking.
- Application NoteAI-generated Summary: When connecting IGBTs in parallel, current unbalance occurs due to differences in VCE(sat) and parasitic resistances in the wiring and board. This unbalance affects device loss and switching behavior. Minimizing VCE(sat) variation by using devices from the same production lot and designing symmetrical layouts reduces unbalance. Gate driver emitter-sense wiring must also be symmetrical to ensure equal gate voltages. Temperature dependence of VCE(sat) influences current sharing, with positive temperature dependence improving stability.
- Application NoteAI-generated Summary: The document defines absolute maximum ratings for IGBTs, including voltage, current, power dissipation, and temperature limits to ensure safe operation. It details electrical characteristics such as leakage currents, capacitances, switching times, and energy losses. Collector current and dissipation depend on temperature and voltage, with formulas provided for calculation. Users must operate IGBTs within specified maximum ratings to maintain reliability.
- DatasheetPDF 185 KB R07DS1191EJ0200 Rev.2.00 Apr 02, 2014
- DatasheetPDF 185 KB R07DS1191EJ0200 Rev.2.00 Apr 02, 2014
Recommended Documents (1)
- DatasheetPDF 185 KB R07DS1191EJ0200 Rev.2.00 Apr 02, 2014
Datasheets (1)
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- Application NoteAI-generated Summary: The document outlines derating standards for Power MOSFETs and IGBTs, emphasizing temperature, humidity, voltage, current, and power limits to ensure device reliability. It discusses package type selection between hermetic sealed and plastic molded types, highlighting the advantages of surface-mount packages for miniaturization. It also details precautions for physical handling, including proper lead forming, cutting, and mounting techniques to prevent stress and damage during installation.
- Application NoteAI-generated Summary: The TO-247plus package differs from the TO-247 mainly by including screw holes while maintaining similar external dimensions and pin pitch, allowing easy board design compatibility. Heat dissipation is critical for IGBTs due to power generation; proper mounting torque (20-100 N) ensures stable thermal contact without damaging the device. Applying thermal grease significantly improves heat conduction by reducing thermal resistance by 1.8 times. The TO-247plus package offers better heat dissipation than TO-247 due to a larger chip mounting frame. Proper device handling during heatsink mounting prevents damage such as resin chipping or internal cracking.
- Application NoteAI-generated Summary: When connecting IGBTs in parallel, current unbalance occurs due to differences in VCE(sat) and parasitic resistances in the wiring and board. This unbalance affects device loss and switching behavior. Minimizing VCE(sat) variation by using devices from the same production lot and designing symmetrical layouts reduces unbalance. Gate driver emitter-sense wiring must also be symmetrical to ensure equal gate voltages. Temperature dependence of VCE(sat) influences current sharing, with positive temperature dependence improving stability.
- Application NoteAI-generated Summary: The document defines absolute maximum ratings for IGBTs, including voltage, current, power dissipation, and temperature limits to ensure safe operation. It details electrical characteristics such as leakage currents, capacitances, switching times, and energy losses. Collector current and dissipation depend on temperature and voltage, with formulas provided for calculation. Users must operate IGBTs within specified maximum ratings to maintain reliability.
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