Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 95°C |
| 3dB Bandwidth (GHz) | 84 |
| Application | 800G and beyond coherent systems with 128Gbaud QAM |
| Channels (#) | 2 |
| Country of Wafer Fabrication | USA |
| Data Rate Max (Gbps) | 128 |
| Function | Linear TIA |
| MOQ | 110 |
| Peaking Frequency (Typical) (GHz) | 69 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $203.595 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Tape & Reel | No |
Resources for RG8G31223
Description
The RG8G31223 is a dual‑channel, 128Gbaud linear transimpedance amplifier (TIA) for 800G and beyond integrated coherent receivers (ICRs). The device integrates two TIA signal paths for the I and Q channels. Its high‑performance, low‑power, and compact design enables an optical subassembly, such as micro‑ICR or IC‑TROSA, for use in small‑form‑factor (SFF) integrated optical modules.
