Features
- Using the PowerVR Series8XE 3D graphics cores from Imagination Technologies' latest series, the R-Car D3e achieves approximately six times the rendering performance of the existing R-Car D1
- System developers creates 3D clusters using low-cost 4-layer printed circuit boards and reduce the number of parts, that enables reduced system bill of materials (BOM) costs and achieves system costs as low as current 2D cluster systems
- Renesas is working together with industry-leading partners in the instrument cluster field to provide solutions that will reduce development steps and costs
Specifications
- Product No.: R-Car D3e (R8A779M7)
- Power supply voltage: 3.3/1.8V (IO), 2.5V (Ether), 1.5V (DDR3) / 1.35V (DDR3L), 1.03V (core)
- CPU core: Arm®Cortex®-A53
- Cache memory
- L1 Instruction cache: 32KB
- L1 Operand cache: 32KB
- L2 cache: 128KB
- External memory
- DDR3/DDR3L-SDRAM
- Approved standards: DDR3-1866/DDR3L-1866
- Data bus width: 16-bit x 1ch
- Graphics
- 3D Graphics Processing Unit: IMG PowerVR Series8XE GE8300
- 2D Graphics Processing Unit
- Video
- Display Out x 2ch (LVDS x 2 or LVDS + Digital RGB)
- Video Input x 1ch (Digital RGB)
- Up and down scaling, color conversion, rotate, dithering, sharpness
- Distortion compensation module (IMR-LSX4)
- Video output check
- Display Output Compare Unit (DISCOM)
- Video-Output-Checker (VOC)
- Audio
- Sampling rate converter x 2ch
- Serial sound interface x 2ch
- Storage interfaces
- USB 2.0 host/function interface x 1 port (wPHY)
- Multimedia card interface x 1ch
- Raw NAND Flash memory interface x 1ch
- In-car network and automotive peripherals
- Media local bus (MLB) Interface x 1ch (3-pin interface)
- Controller area network (CAN-FD support) Interface x 2ch
- Ethernet AVB 1.0-compatible MAC built in
- Interface: RGMII
- Ethernet AVB (802.1BA)
- IEEE802.1BA
- IEEE802.1AS
- IEEE802.1Qav
- IEEE1722
- Security
- Crypto engine (AES, DES, Hash, RSA)
- SystemRAM
- Other peripherals
- SYS-DMAC x 24ch, Realtime-DMAC x 8ch, Audio-DMAC x 16ch, Audio(peripheral)-DMAC x 4ch
- 32-bit timer x 26ch
- PWM timer x 4ch
- I2C bus interface x 4ch
- Serial communication interface (SCIF) x 11ch
- SPI Multi I/O Bus Controller (RPC) x 2ch (HyperFlash x 1ch support)
- Clock-synchronized serial interface (MSIOF) x 4ch (SPI/IIS)
- Low power mode
- Module standby mode
- DDR-SDRAM power supply backup mode
- Package: 401-pin FCBGA 0.8mm pitch (19mm x 19mm)
- Development environment: ICE for Arm CPU available from tool vendors
- Evaluation board: A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
- Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
- Can be used as a software development tool for application software, etc.
- Allows easy implementation of custom user functions.
- Software Platform: Supported OS: Linux, QNX® Neutrino® RTOS, Integrity® etc.
Arm and Cortex are registered trademarks of Arm Limited PowerVR is a trademark of Imagination Technologies Limited. HyperFlash is a trademark of Cypress Semiconductor Corporation. QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited. Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally. All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Description
Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.
Parameters
| Attributes | Value |
|---|---|
| Parametric Applications | Cluster |
| Real Time Core Freq / KDMIPS | No |
| Application Core | 1x Cortex A53 |
| 3D GPU | GE8300, D/AVE-HD |
| Computer Vision / Frequency | No |
Package Options
| Pkg. Type | Lead Count (#) |
|---|---|
| BFG | 401 |
Applications
- Automotive instrument cluster
Renesas Boards & Kits
3D Graphics Cluster R-Car D3 Development Board/Draak
The R-Car D3, along with its peripheral circuits and interfaces, delivers a 3D graphics cluster solution. This evaluation board enables developers to evaluate the R-Car D3 system-on-chip (SoC) and accelerate the development of hardware and software solutions.
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Application Specific SWCross platform Cinemo SDK, powering the smart cockpit with infotainment use cases like effortless onboarding, seamless media playback, BYOD, multi-screen, premium streaming, in-car gaming, and immersive entertainment.Provided By: Cinemo GmbH- HMIHigh-performance, scalable and hardware-independent HMI software toolchain for embedded systems. Enables development of customizable 2D and 3D graphical user interfaces with a designer-centric workflow, WYSIWYG editor, no-coding methodology and AI-assisted Smart Importer. Integrated state machine and automated workflows accelerate development. Scales efficiently from low-end ...Provided By: Candera GmbH
- Application Specific SWAutomotive sound generation middleware that enables sound design and tuning on actual hardware or production-equivalent environments. Sound sources are adjusted and verified in real-time using the target device, reducing gaps between prototyping and mass production. Standardizes sound control in software to ensure consistent behavior across different microcontrollers or ...Provided By: CRI Middleware Co., Ltd.
- AIProvides reliable in-cabin sensing through Driver Monitoring Systems (DMS) and Occupant Monitoring Systems (OMS), backed by a long track record in automotive production. Supports deployment of Automotive Safety Integrity Level (ASIL)-rated software alongside advanced safety and cockpit applications on automotive systems-on-chip (SoCs).Provided By: Smarteye
- Security & SafetyEB tresos delivers a comprehensive product portfolio that forms the core technology for safe, secure, and flexible ECU software based on Classic AUTOSAR and ISO 26262 functional safety. The platform aligns with high-quality development standards, meeting Automotive SPICE Level 2 requirements and supporting stringent fail-safe and security demands ...Provided By: Elektrobit Automotive GmbHView More (33)
