Features
- Buck Mode: Input Voltage Range 3V to 36V (Refer to "Input Voltage" on page 13 for more details)
- Boost Mode Expands Operating Input Voltage Lower Than 2.5V (Refer to "Input Voltage" on page 13 for more details)
- Selectable Forced PWM Mode or PFM Mode
- 300µA IC Quiescent Current (PFM, No Load); 180µA Input Quiescent Current (PFM, No Load, VOUT Connected to AUXVCC)
- Less than 3µA Shut Down Input Current (IC Disabled)
- Operational Topologies
- Synchronous Buck
- Non-Synchronous Buck
- Two-Stage Boost Buck
- Programmable Frequency from 200kHz to 2.2MHz and Frequency Synchronization Capability
- ±1% Tight Voltage Regulation Accuracy
- Reliable Overcurrent Protection
- Temperature Compensated Current Sense
- Cycle-by-Cycle Current Limiting with Frequency Foldback
- Hiccup Mode for Worst Case Short Condition
- 20 Ld 4x4 QFN Package
- Pb-Free (RoHS Compliant)
Description
Support is limited to customers who have already adopted these products.
The ISL85402 is a synchronous buck controller with a 125mΩ high-side MOSFET and low-side driver integrated. The ISL85402 supports a wide input range of 3V to 36V in buck mode. It supports 2.5A continuous load under conditions of 5V VOUT, VIN range of 8V to 36V, 500kHz and +105°C ambient temperature with still air. For any specific application, the actual maximum output current depends upon the die temperature not exceeding +125°C with the power dissipated in the IC, which is related to input voltage, output voltage, duty cycle, switching frequency, board layout and ambient temperature, etc. Refer to “Output Current” on page 14 for more details. The ISL85402 has a flexible selection of operation modes of forced PWM mode and PFM mode. In PFM mode, the quiescent input current is as low as 180µA (AUXVCC connected to VOUT). The load boundary between PFM and PWM can be programmed to cover wide applications. The low-side driver can be either used to drive an external low-side MOSFET for a synchronous buck, or left unused for a standard non-synchronous buck. The low-side driver can also be used to drive a boost converter as a pre-regulator followed by a buck controlled by the same IC, which greatly expands the operating input voltage range down to 2.5V or lower (Refer to “Typical Application Schematic III - Boost Buck Converter” on page 5). The ISL85402 offers the most robust current protections. It uses peak current mode control with cycle-by-cycle current limiting. It is implemented with frequency foldback under current limit condition; besides that, the hiccup overcurrent mode is also implemented to guarantee reliable operations under harsh short conditions. The ISL85402 has comprehensive protections against various faults including overvoltage and over-temperature protections, etc.
Applications
- General Purpose
- 24V Bus Power
- Battery Power
- Point of Load
- Embedded Processor and I/O Supplies
| Part Number | Status | Samples | Stock | Package | Carrier Type | MOQ |
|---|---|---|---|---|---|---|
| ISL85402IRZ | Obsolete | N/A | In Stock | QFN | Tube | 750 |
| ISL85402IRZ-T | Obsolete | N/A | Out of Stock | QFN | Reel | 6000 |
| ISL85402IRZ-T7A | Obsolete | N/A | Out of Stock | QFN | Reel | 250 |
| ISL85402IRZ-TK | Obsolete | N/A | Out of Stock | QFN | Reel | 1000 |
Filters
Applied Filters
- Application NotePDF 592 KB an9208 Feb 01, 2018AI-generated Summary: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- Product Change NoticePDF 151 KB PCN14009 Mar 13, 2014
- Product Change NoticePDF 223 KB PCN13060 Oct 30, 2013
- Product Change NoticePDF 169 KB PCN11117 Nov 15, 2011
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- Application NotePDF 650 KB an9210 Dec 21, 2001AI-generated Summary: This document presents a new PSPICE subcircuit model for power MOSFETs with global temperature options. It details synchronous rectifier circuit operation, including gate biasing and conduction modes. The model accurately simulates switching waveforms, diode recovery, and temperature-dependent efficiency. Measured and modeled data show excellent correlation for output characteristics, threshold voltage, breakdown voltage, and on-resistance across temperature ranges. Limitations in linear mode modeling are noted due to PSPICE assumptions.
- Application NotePDF 387 KB an9209 Aug 13, 1998AI-generated Summary: The document presents an empirical SPICE-2 subcircuit model for power MOSFETs, accurately simulating static and dynamic behaviors including first and third-quadrant operations and avalanche breakdown. The model aligns closely with measured data and is compatible with all SPICE versions without code modification. It uses parameters derived from datasheets or simple measurements. The document also includes detailed comparisons of measured and calculated curves for transfer, output, switching, and diode recovery characteristics. Additionally, it provides legal and usage disclaimers from Renesas Electronics.
- Application NotePDF 349 KB an7244 Aug 12, 1998AI-generated Summary: Power MOSFETs feature a positive temperature coefficient of resistance, enhancing stability and preventing thermal runaway by increasing resistance as temperature rises. Their gate terminals have extremely high input impedance with minimal leakage current, dominated by capacitive characteristics. Switching speed depends on gate resistance and capacitance, with polysilicon gates offering higher resistance and lower frequency operation than metal gates. MOSFETs require a gate-to-source voltage exceeding a threshold (around 2V) and typically about 10V to fully saturate and deliver maximum drain current. TTL and CMOS drivers differ in voltage capability and switching speed, often requiring buffering for optimal performance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 592 KB an9208 Feb 01, 2018AI-generated Summary: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- Application NotePDF 650 KB an9210 Dec 21, 2001AI-generated Summary: This document presents a new PSPICE subcircuit model for power MOSFETs with global temperature options. It details synchronous rectifier circuit operation, including gate biasing and conduction modes. The model accurately simulates switching waveforms, diode recovery, and temperature-dependent efficiency. Measured and modeled data show excellent correlation for output characteristics, threshold voltage, breakdown voltage, and on-resistance across temperature ranges. Limitations in linear mode modeling are noted due to PSPICE assumptions.
- Application NotePDF 387 KB an9209 Aug 13, 1998AI-generated Summary: The document presents an empirical SPICE-2 subcircuit model for power MOSFETs, accurately simulating static and dynamic behaviors including first and third-quadrant operations and avalanche breakdown. The model aligns closely with measured data and is compatible with all SPICE versions without code modification. It uses parameters derived from datasheets or simple measurements. The document also includes detailed comparisons of measured and calculated curves for transfer, output, switching, and diode recovery characteristics. Additionally, it provides legal and usage disclaimers from Renesas Electronics.View More (6)
Application Notes & White Papers (6)
- Product Change NoticePDF 151 KB PCN14009 Mar 13, 2014
- Product Change NoticePDF 223 KB PCN13060 Oct 30, 2013
- Product Change NoticePDF 169 KB PCN11117 Nov 15, 2011
Product Notices (PCN, EOL, etc) (4)
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