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Multi-Core Bluetooth 5.2 SoC with System Power Management Unit

Package Information

Pkg. Type: VFBGA
Pkg. Code:
Lead Count (#): 86
Pkg. Dimensions (mm): 6 x 6 x 0.82
Pitch (mm): 0.55

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 86
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
Temp. Range (°C) -40 to +85°C
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) 5.166
2Mbps Supported
ADC 10-bit x 8-ch, 14-bit x 8-ch
AoA Supported
AoD TX Supported
Application General purpose connectivity MCU, ATLAS, Asset tracking, Connected health, Proximity tags & trackers, Wireless Ranging (WiRa)
Bluetooth® Mesh Not Supported
Budgetary Price (100u) (USD) 5.211
Budgetary Price (1ku) (USD) 4.114
Budgetary Price (1u) (USD) 7.836
CPU M33F
Clock Rate (MHz) 96
Execute from FLASH Yes
Extended Advertising Supported
External Rails and Load Capacity 3x 1.8V @ 50mA each
Flash Memory (KB) 0
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 44
Hardware Crypto Engine Yes
I2C (#) 2
Integrated Battery Charger No
Integrated DCDC SIMO Buck DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
Longevity 2034 Jan
MCU/MPU M33
MOQ 4000
Memory Size (OTP) (KB) 4
Operating Freq (Max) (MHz) 96
Output Power Range (dBm) -18 - 6
Periodic Advertising Supported
Pitch (mm) 0.55
Pkg. Dimensions (mm) 6 x 6 x 0.82
Pkg. Type VFBGA
Proprietary 2G4 protocol Yes
Published Yes
QSPI Interface (#) 1
Qty. per Reel (#) 4000
RAM (KB) 384
ROM (KB) 128
Recommended for new Designs Yes
Rx current (mA) 1.8
SPI (#) 2
Sensitivity (dBm) (dBm) -97
Supply Voltage Vcc Range 2.4-5.75
Tx Current (mA) 3
UART (#) 3
USB Ports (#) 1
Wireless Standard BLE 5.2 Core specification + optional features

Description

The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions features advanced multi-core microcontroller units designed for robust wireless connectivity. Building on the success of Renesas' SmartBond line, these units include three additional cores, enhancing processing power, resources, range, and battery life. This expanded capability supports a variety of consumer applications, including high-end fitness trackers, sophisticated smart home devices, and immersive virtual reality game controllers.

Powered by the Arm® Cortex®-M33 processor, the DA1469x products deliver superior processing performance, catering to demanding applications. They also support the latest Bluetooth Low Energy 5.2 protocol and proprietary 2.4GHz deployment, facilitating precise Real-Time Locating Systems (RTLS) and low-latency communications. The inclusion of a Sensor Node Controller (SNC) allows for autonomous sensor data processing, further enhancing device functionality.

The DA1469x family is equipped with a state-of-the-art Power Management Unit that optimizes energy efficiency by selectively activating processing cores only when needed. This integration eliminates the requirement for a separate PMIC, thereby reducing system size and enhancing overall performance.

Benefits

  • Supports complex applications while guaranteeing extremely low power consumption
  • Software programmable protocol engine ensures end products are future proof
  • Enables a rich user experience
  • Provides banking-level security for application, data, and communication
  • Saves up to $1.28 on BOM vs. existing wireless MCUs
  • Saves up to 38mm2 of PCB space (components + routing) vs. existing wireless MCUs