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SmartBond™ Bluetooth 5.0 SoC with Audio Interface

Package Information

Lead Count (#) 40
Pkg. Dimensions (mm) 5 x 5 x 0.9
Pitch (mm) 0.4
Pkg. Type QFN

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 40
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 3
Application Industrial, Beacons, Proximity tags & trackers, HID, RCU
GPIOs (#) 14
Pkg. Dimensions (mm) 5 x 5 x 0.9
Qty. per Reel (#) 5000
Rx current (mA) 5.3
Tx Current (mA) 4.9
Pb (Lead) Free Yes
Temp. Range -40 to +105°C
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) 3.52996
2Mbps Not Supported
ADC 10-bit x 4-ch
AoA Not Supported
AoD Not Supported
Bluetooth® Mesh Not Supported
CPU M0
Clock Rate (MHz) 16
Execute from FLASH No
Extended Advertising Not Supported
External Rails and Load Capacity none
Flash Memory (KB) 0
Flexible System Clock No
GATT Caching Not Supported
Hardware Crypto Engine Yes
I2C (#) 1
Integrated Battery Charger No
Integrated DCDC Integrated Buck/Boost DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
Longevity 2032 Jun
MOQ 5000
Memory Size (OTP) (KB) 64
Output Power Range (dBm) 0 - 0
Periodic Advertising Not Supported
Pitch (mm) 0.4
Pkg. Type QFN
Proprietary 2G4 protocol No
QSPI Interface (#) 0
RAM (KB) 96
ROM (KB) 128
SPI (#) 1
Sensitivity (dBm) (dBm) -93
Supply Voltage Vcc Range 0.9-3.5
UART (#) 2
USB Ports (#) 0
Wireless Standard BLE 5.0 Core specification

Description

Connected devices are constantly evolving. New generations appear that are smarter, more full-featured and have longer battery lifetimes. To enable this, SmartBond™ has evolved too. SmartBond 5.0 is smarter, more flexible, and even lower power. The DA14585 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14585 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14585 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V to 3.6V) covers a larger choice of energy sources and gives full design flexibility.

Like all SmartBond solutions, the DA14585 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

Benefits

  • Large memory to build complex applications
  • Longest battery life
  • Low system Bill of Materials (BOM)

Packages

  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • WLCSP-34 (2.4mm x 2.66mm x 0.39mm)