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Renesas Electronics Corporation

Renesas’ Timing product portfolio has been acquired by SiTime.

Datasheets, documentation, and sample orders remain available on Renesas.com through late 2026. For new designs, purchasing, support, and product inquiries, visit SiTime.com or send an email to [email protected]. Full transition to SiTime is expected by late 2026.

Low Skew DDR II Fan-out Buffer

Package Information

Pkg. Type:SSOP
Pkg. Code:PYG28
Lead Count (#):28
Pkg. Dimensions (mm):10.2 x 5.3 x 1.73
Pitch (mm):0.65

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)1
ECCN (US)
HTS (US)

Product Attributes

Pkg. TypeSSOP
Lead Count (#)28
Pb (Lead) FreeYes
Carrier TypeTube
Accepts Spread Spec InputYes
Advanced FeaturesAccepts Spread Spec Input, Reference Output
App Jitter ComplianceDDR2
C-C Jitter Max P-P (ps)50
Core Voltage (V)1.8
Delay ModeVariable
Die FormNo
Diff. Input SignalingSSTL-2
Diff. Output SignalingSSTL-2
FunctionBuffer
Input Freq (MHz)125 - 400
Inputs (#)0
Length (mm)10.2
MOQ141
Moisture Sensitivity Level (MSL)1
Output Banks (#)1
Output Freq Range (MHz)125 - 400
Output Skew (ps)40
Output TypeSSTL-2
Output Voltage (V)1.8
Outputs (#)6
Package Area (mm²)54.1
Pb Free Categorye3 Sn
Period Jitter Max P-P (ps)30
Pitch (mm)0.65
Pkg. Dimensions (mm)10.2 x 5.3 x 1.73
Qty. per Carrier (#)47
Qty. per Reel (#)0
Reference OutputYes
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Spread SpectrumNo
Supply Voltage (V)1.8 - 1.8
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.73
Width (mm)5.3

Description

DDR II fanout buffer for VIA Chipset