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Renesas Electronics Corporation
100V 5mΩ E-Mode GaN FET in 3.3 × 3.3mm FCLGA Package

Package Information

CAD Model:View CAD Model
Pkg. Type:FCLGA
Pkg. Code:FL0009AA
Lead Count (#):9
Pkg. Dimensions (mm):3.3 x 3.3 x 0.902
Pitch (mm):0.65

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8541.29.0095
RoHS (RTP100E005G1FL-TR)EnglishJapanese
Pb (Lead) Free

Product Attributes

Pkg. TypeFCLGA
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Mounting TypeSurface Mount
Temp. Range (°C)-40 to +150°C
Assembly LocationCHINA
Wafer Fab LocationTaiwan
Blocking CapabilityUni-Directional Switch
Ciss (Typical) (pF)862
Coss (Typical) (pF)317
FET TypeE-mode GaN
IDS (A) @ Ta = 25°C17
IDS (A) @ Tc = 25°C59
Id max @ 25°C (A)17
Lead Count (#)9
Pitch (mm)0.65
Pkg. Dimensions (mm)3.3 x 3.3 x 0.902
Price (USD)$1.15
Qg typ (nC)5.2
Qoss (nC)24.2
Qualification LevelStandard
Quality LevelStandard
RDSON (Typ) (mΩ)5
RDSON (max) (mΩ)6.5
Ron * Qoss (FOM)121
Theta-JA (°C/W)45
V(TR)DSS max (V)120
Vds min (V)100
Vth typ (V)1.2

Description

The RTP100E005G1FL is a 100V, 5mΩ enhancement-mode (e-mode) gallium nitride (GaN) FET built on Renesas' Gen 1 REXGaN® platform and housed in a compact 3.3mm × 3.3mm FCLGA package. Utilizing advanced packaging technology, it combines ultra-fast switching performance with enhanced thermal characteristics to enable high-efficiency, high-power-density designs. Its silicon-compatible footprint simplifies migration from traditional silicon MOSFETs to GaN technology, helping reduce development time, system size, and overall power losses.