This blog presents an overview of the latest Bluetooth Low Energy (LE) specification release 5.3 and the value those new features will bring to Renesas customers and their next-generation designs.
The unified and scalable SMARC EVK platform makes it easy for customers to evaluate their products quickly and expand their product lineup by changing the CPU-embedded modules.
Providing coverage across all mainstream Renesas MCUs from 8 to 32 bits, the Renesas Ready Partner Network makes it simple to find and integrate solutions tailored to your requirements.
Various networks can be executed on an MCU using 8-bit quantization, which has a large effect in reducing the ROM/RAM usage of a neural network with little decrease in accuracy, an ideal function for MCUs.
This interview with HITACHI Solutions Technology details their adoption of the RX72N MCU for easy improvement of system performance and functionality and easy development for the long-term.
In this post, we will look at how the 10BASE-T1S and CAN XL protocols could be used in a system and what is necessary to connect CAN XL and 10BASE-T1S to an IVN backbone.
In this blog, we will explain how Renesas contributes with the new R-Car S4 based chipset to a smarter E/E architecture in the Automotive market.
In this blog, we will discuss how electrical fast transients (EFTs) are caused, how transceiver EFT performance is measured, and the EFT measurement results for RS-485 transceivers.
Introducing the I3C interface for DDR5 DIMM LED control solution based on new entry-level RA Family RA2E2 MCU Group.
Introducing a new board feature of the Smart Configurator tool that will assist in selecting software components (i.e., middleware and drivers) that will work nicely with your Renesas board.