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The S5D3 adds a new tier to the S5 MCU series for applications that require a high-performance Cortex M4F core at a very attractive price point, that does not require on-chip graphic acceleration or Ethernet connectivity. The S5D3 is built on a highly efficient 40nm process, offers enhanced security, wide connectivity and is fully supported by the Synergy Software Package (SSP).

Synergy Software Package (SSP)

Commercial software worth over $100K which is available to developers using the Synergy Platform for no charge and with unlimited production license rights. The production-ready SSP is fully tested, maintained, and supported by Renesas.

Download SSP

Features

  • 120 MHz Arm® Cortex®-M4 CPU
  • Optimal for applications that require a high-performance Cortex M4F core, that does not require on-chip graphic acceleration or Ethernet connectivity.
  • Available in a variety of packages
  • Capacitive Touch Sensing Unit
  • High precision data acquisition analog interfaces
  • Enhanced security

Applications

  • IoT Smart Edge Sensor

descriptionDocumentation

Title language Type Format File Size Date
Datasheets & Errata
S5D3 Microcontroller Group Datasheet (R01DS0328EU0110) – Datasheet PDF 1.15 MB
User Guides & Manuals
star S5D3 Microcontroller Group User's Manual – Manual - Hardware PDF 19.37 MB
TB-S5D3 – User's Manual 日本語 Manual - Development Tools PDF 2.49 MB
Target Board Kit S5D3 (TB-S5D3) Quick Start Guide 日本語 Quick Start Guide PDF 243 KB
Technical Updates
S5D3 MCU Group, Note on the number of ADC channels. – Technical Update PDF 710 KB
S128 MCU Group, S1JA MCU Group, S3A1 MCU Group, S3A3 MCU Group, S3A6 MCU Group, S3A7 MCU Group, S5D3 MCU Group, S5D5 MCU Group, S5D9 MCU Group, Note on ALeRASE command – Technical Update PDF 153 KB
S5D3 Group, S5D5 Group, S5D9 Group, VBATT minimum voltage level enhancement – Technical Update PDF 220 KB
S5D3 Group, S5D5 Group, S5D9 Group, adding LGA/BGA packages with operating temperature -40 to +105 °C support – Technical Update PDF 134 KB
S5D3, S5D5, S5D9 Errata for User's Manual: Hardware for I/O port – Technical Update PDF 195 KB
Errata for User's Manual: Hardware for HOCO (TN-SY-A0053A/E) – Technical Update PDF 116 KB
Errata for User's Manual: Hardware for HOCO (TN-SY-A0054A/E) – Technical Update PDF 110 KB
Application Notes & White Papers
Capacitive Sensor Microcontrollers CTSU Capacitive Touch Electrode Design Guide 日本語 Application Note PDF 2.72 MB
Renesas Synergy™ Platform Pin Configurator Usage 日本語 Application Note PDF 2.27 MB
Out-of-Box (OoB) Demonstration (Blinky) Application for S1/S3/S5 Target Board Kits
Related Files: Sample Code 		– Application Note PDF 250 KB
USBX™ CDC ACM (Device) Application for S1/S3/S5 Target Board Kits - Application Project
Related Files: Sample Code 		– Application Note PDF 586 KB
User Button/CTSU Button Application for S1/S3/S5 Target Board Kits
Related Files: Sample Code 		– Application Note PDF 650 KB
Creating a Custom Board Support Package for SSP 1.1.z - Application Project
Related Files: Sample Code 		– Application Note PDF 439 KB
Other
Renesas Synergy™ Platform Brochure – Brochure PDF 3.08 MB
Semiconductor Package Mount Manual 日本語, 简体中文 Other PDF 10.28 MB
Semiconductor Reliability Handbook 日本語 General Reliability Literature PDF 14.70 MB
info: For device-specific or order-specific documentation, submit a support request.

file_downloadDownloads

Title language Type Format File Size Date
Sample Code
USBX™ CDC ACM (Device) Application for S1/S3/S5 Target Board Kits - Application Project Rev.1.07 - Sample Code – Sample Code ZIP 6.84 MB
- USBX™ CDC ACM (Device) Application for S1/S3/S5 Target Board Kits - Application Project – Application Note PDF 586 KB
Out-of-Box (OoB) Demonstration (Blinky) Application for S1/S3/S5 Target Board Kits Rev.1.05 - Sample Code – Sample Code ZIP 6.46 MB
- Out-of-Box (OoB) Demonstration (Blinky) Application for S1/S3/S5 Target Board Kits – Application Note PDF 250 KB
User Button/CTSU Button Application for S1/S3/S5 Target Board Kits Rev.1.05 - Sample Code – Sample Code ZIP 7.40 MB
- User Button/CTSU Button Application for S1/S3/S5 Target Board Kits – Application Note PDF 650 KB
Creating a Custom Board Support Package for SSP 1.1.z - Application Project Rev.1.06 - Sample Code – Sample Code ZIP 8.43 MB
- Creating a Custom Board Support Package for SSP 1.1.z - Application Project – Application Note PDF 439 KB
Models
Renesas Synergy™ S5D3 BSDL Rev.1.00 (synergy-s5d3-bsdl-rev100.zip) 日本語 Model - IBIS ZIP 10 KB
Renesas Synergy™ S5D3 IBIS Rev.1.00 (synergy-s5d3-ibis-rev100.zip) 日本語 Model - IBIS ZIP 2.07 MB
Hardware
Renesas Synergy™ Target Board TB-S5D3 v1.2 Design Data – PCB Design Files ZIP 32.82 MB

select_allSoftware & Tool Pages

Title Type Description Company
Renesas Synergy™ Software Package (SSP) Software Package Tightly integrated, optimized, and qualified suite of software with a commercial RTOS that scales with end-product complexity and simplifies complex system-level services. Renesas
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
(Note: You need to install compiler separately as an additional software)
(Note: No separate e² studio installation required for RA FSP, this will be installed as part of the FSP with e² studio installer (Platform Installer) on GitHub.)
 Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
 Renesas

memoryBoards & Kits

Part Number Title Type Company
YSTBS5D3E10 TB-S5D3 Target Board Kit Evaluation Renesas

printNews & Additional Resources

Type Date
Renesas Synergy™ Support Page May 5, 2020