Interface & Connectivity


The RYZ012x1 is a highly integrated wireless communication module that provides a pre-certified solution for Bluetooth® 5.0 Low Energy (LE). The network stack is executed inside the module, so there is no need for external stack operation. The module is available in two configurations (RYZ012A1 and RYZ012B1) with or without a mounted antenna. This allows for implementation flexibility and the option for longer wireless range requirements. For easy system creation, the module supports a pre-defined serial communication interface minimizing software effort and flattening the Bluetooth LE learning curve. Supported by the RA MCU family’s Flexible Software Package (FSP) and the QE for BLE tool, customers can focus on application development without dealing with the details of Bluetooth LE.

  • Bluetooth LE ISM 2.4GHz RF transceiver embedded
  • Bluetooth® 5 compliant (1Mbps, 2Mbps)
  • Low power RF operation (TX:4.8 mA, RX:5.3 mA)
  • Big link budget of 106dBm @ 1Mbps
    • Bluetooth LE receiver sensitivity -96dBm @ 1Mbps, -93dBm @2Mbps, -101dBm @125kbps
    • Transmitter output power up to +10dBm
  • Two configurations
    • RYZ012A1: With mounted antenna
    • RYZ012B1: Single pin antenna interface without a mounted antenna
  • RSSI monitoring with ±1dB  resolution
  • Global RF certification (FCC/ISED, CE, MIC (Japan))
  • Bluetooth certification (Declaration ID: D054228, QDIDs: 136037 / 160268 )
  • UART and SPI interface for communication via serial command interface to host MCU
  • 26-pin package, 12mm x 12mm, 2.31mm height
  • Smart home
  • Wearables & trackers
  • Agriculture
  • General phone connectivity
  • Entry-level mass market products requiring basic Bluetooth LE functionality with minimum design and qualification effort


Title Type Date
PDF637 KB日本語
PDF2.01 MB
Related Files: Sample Code
Application Note
PDF1.08 MB日本語
Related Files: Sample Code
Application Note
PDF527 KB日本語
Product Advisory

Design & Development

Software & Tool Pages

Title Type Company
Flexible Software Package (FSP)FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required.
Software Package Renesas
QE for BLE: Development Assistance Tool for Bluetooth® Low EnergyDebugging support tool that specializes in Bluetooth® Low Energy system development [Plugin for Renesas IDE "e2 studio"] [Support MCU/MPU: RA, RX, RL78] Solution Toolkit Renesas

Sample Code

Title Type Date
ZIP2.07 MB
Related Files: RYZ012 Bluetooth LE sample application
Application: Consumer Electronics, Industrial
Compiler: GNU ARM Embedded
Function: Communication Interface
IDE: e2 studio
Sample Code
ZIP3.62 MB日本語
Related Files: RYZ012x1 Bluetooth qualification acquisition Application Note
Sample Code

Boards & Kits


Videos & Training

RYZ012 Certified Bluetooth 5.0 LE Modules

Shorten your time to market with these turnkey certified Bluetooth LE modules for IoT solutions.

GATTBrowser - iOS/Android Application

The GATTBrowser smartphone application can be downloaded from the Apple App Store and Google Play. The GATTBrowser app is used to check Bluetooth LE behavior. It can scan LE devices which are advertising in the vicinity and can perform GATT-based communication with the connected LE device. You can easily check the sample application behavior. GATTBrowser assists in the development of products that implement the Renesas Bluetooth LE MCU and module.

Download GATTBrowser: