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Renesas Electronics Corporation

High-Performance Vision AI System

Overview

Description

Enabling vision capabilities across various systems and platforms—such as robotics, industrial automation, and camera systems—is becoming increasingly important. Many applications require up to four camera inputs, each supporting high resolution and a robust AI engine for real-time performance and analytics. These vision systems must also deliver strong video and AI performance for preprocessing, post-processing, and analysis of large image and video data.

This high-performance vision AI system enables quad-camera support with high-precision, high-speed processing of up to 80TOPS (sparse), leveraging Renesas' DRP-AI high-efficiency AI accelerator and OpenCV image processing accelerator. The platform offers exceptional power efficiency, enabling compact, fanless operation, and can be easily integrated into various systems to deliver high-performance vision AI processing.

System Benefits:

  • Easily integrates into existing systems to add high-performance vision AI with minimal redesign
  • Supports up to four concurrent high-resolution video streams with 4×4-lane MIPI CSI
  • Ultra-high speed hardware AI inference (DRP-AI) with up to 80TOPS (sparse), meeting the needs of vision AI applications
  • Low power dissipation enables fanless operation, reducing BOM cost and system size

Comparison

Applications

Block Diagram

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WS002: WEBLine Arrow.1580.8V0.8V0.8VLine Arrow.1620.8V0.8V0.8VLine Arrow.1650.9V0.9V0.9VLine Arrow.1681.2V1.2V1.2VLine Arrow.1711.8V1.8V1.8VLine Arrow.1741.8V1.8V1.8VLine Arrow.1771.8V1.8V1.8VLine Arrow1.8V1.8V1.8VLine Arrow.1833.3V3.3V3.3VWS002WS002WS00212-15VIN12-15VIN12-15VINInput arrow.4Connector Arrow.95VBaseboard5VBaseboard5VBaseboardConnected signals arrow.135Connected signals arrow.137Line Arrow.1383.3V3.3V3.3VLine Arrow.1411.8V1.8V1.8VConnected signals arrow.143Line Arrow.1471.2V1.2V1.2VConnected signals arrow.149PMICPMICPMICInput arrow5VBaseboard5VBaseboard5VBaseboardComponent block.631LPDDRLPDDRLPDDRLine Bi-directionalLine Arrow.1931.1V1.1V1.1VDual componentComponent block.631DC/DCDC/DCDC/DCConnected signals arrow.201Connector Arrow0.8V0.8V0.8VLine Arrow.7824MHz24MHz24MHzLine Arrow.80100MHz100MHz100MHzLine Arrow.8232.768kHz32.768kHz32.768kHzLine Arrow.8424.578kHz24.578kHz24.578kHzLine Arrow.8622.579kHz22.579kHz22.579kHzClockClockClock1.8V1.8V1.8VInput arrow.218SPI FlashSPI FlashSPI FlashBi-directionalEMMCEMMCEMMCBi-directional.224SD CardSheet.226Sheet.227Sheet.228Sheet.229Sheet.230Sheet.231Sheet.232Sheet.233Sheet.234Sheet.235PClePClePCleBi-directional.242Connector Arrow.243Quad component.201Component block.751Component block.747Component block.748Load SwitchLoad SwitchLoad SwitchConnected signals arrow.250USB 2.0USB 2.0USB 2.0USB 3.0USB 3.0USB 3.0Line Bi-directional.253Line Bi-directional.254Line Bi-directional.255Line Bi-directional.256Line Arrow.2613.3V3.3V3.3VLine Bi-directional.263Line Arrow.264Connected signals lineEthernet PHYEthernet PHYEthernet PHYBi-directional.269UARTUARTUARTBi-directional.272DisplayDisplayDisplayBi-directional.275Quad component non RenesasComponent block.751Component block.747Component block.748CameraCameraCameraBi-directional.282CameraSheet.284Sheet.285SoMSoMSoMBaseboard/Carrier BoardBaseboard/Carrier BoardBaseboard/Carrier BoardWi-Fi/Bluetooth LEWi-Fi/Bluetooth LEWi-Fi/Bluetooth LELine Bi-directional.297DC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCDC/DCUSB PDUSB PDUSB PDLoad SwitchLoad SwitchLoad SwitchLoad SwitchLoad SwitchLoad SwitchConnected signals arrowDC/DCDC/DCDC/DCSheet.298MPUMPUMPUDDRDDRDDRSPIFISPIFISPIFISDISDISDIEthernetEthernetEthernetUSBUSBUSBPClePClePCleUARTUARTUARTMIPI DSIMIPI DSIMIPI DSIMIPI CSIMIPI CSIMIPI CSI UARTUARTUART
Exiting Interactive Block Diagram

Documentation

Partners

ARIES Embedded GmbH Logo
ARIES Embedded GmbH

ARIES Embedded GmbH is a German provider of embedded computing solutions, specializing in system-on-module platforms for industrial and AI-driven applications. The MSRZV2H is an open standard module (OSM) compliant system-in-package based on the Renesas RZ/V2H architecture, combining quad Arm® Cortex®-A55 cores with dual Arm Cortex-R9, an Arm Cortex-M33 core, and an integrated DRP AI accelerator. Featuring a compact design, rich high-speed interfaces, and scalable performance with low power consumption, the board is well-suited for advanced vision systems, drones, and industrial embedded applications.

Learn more about the ARIES Embedded MSRZV2H OSM

IMDT Ltd. Logo
IMDT

IMDT is a leading provider of embedded computing platforms, delivering scalable and customizable hardware solutions for AI, vision, and edge applications. The IMDT V2H SBC portfolio, including the V2H 4X SBC and V2H SBC carrier board, is built around the Renesas RZ/V2H processor and delivers high-performance quad Arm® Cortex®-A55 computing with an integrated DRP-AI3 accelerator for vision-centric workloads. Featuring support for multi-camera MIPI CSI interfaces, high-bandwidth PCIe Gen3 for external accelerators, rich I/O, and flexible configuration options, these compact and energy-efficient boards are well-suited for robotics, industrial automation, drones, and smart city applications.

Learn more about the IMDT V2H 4X SBC
Learn more about the IMDT V2H SBC
Learn more about the IMDT V2H SOM

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