RZ/A1L

Features

CPU: Cortex-A9 core, Max. 400MHz
Power supply voltage: 3.3V/1.8V
Package: 176-pin LFBGA, 176/208 pin LFQFP
On-chip RAM: Large-capacity memory
Graphics functions: Video display controller, Capture engine unit
Connectivity: Ethernet, USB host/function x 2 channels, SD host interface x 2 channels, etc.
Others: A/D converter (12-bit resolution) x 8 channels, 32-bit OS timer x 2 channels, Serial communication interface with 16-stage FIFO (SCIF) x 5 channels, etc.

Find Other Products in RZ 32 & 64-Bit MPUs

RZ/A1L Block Diagram

Description

The RZ/A1L Group MPUs feature an Arm® Cortex®-A9 core running at 400MHz and 3MB of on-chip SRAM. With 3MB on-chip SRAM, the RZ/A1L supports up to 2 Displays with WVGA (800x480) resolution or a single display with WSVGA (1024x600) resolution without the need for external memory. RZ/A1L enables very compact embedded designs without the need to worry about memory procurement and memory EOL. With RZ/A1L, you can design your embedded system like an MCU and get the performance of a 400MHz Arm® Cortex®-A9 MPU. Enabled for support with Linux, RTOS or Bare-metal, this is the ideal device for designing Intelligent IoT End Point devices with compactness and high performance. Supported in QFP and BGA packages with different sizes to support board layout flexibility and with SDRAM interface to expand up to 128MB of external memory. Get Started Using RZ/A1 MPUs.

Parameters

Attributes	Value
CPU Architecture	Arm
Main CPU	Cortex-A9
Program Memory (KB)	0
RAM (KB)	3072
Carrier Type	Bulk (Tray), Full Carton (Tray)
Supply Voltage (V)	3 - 3.6
I/O Ports	100, 122
NPU	No
DRAM I/F	SDRAM
3D GPU	No
Temp. Range (°C)	Ta = -40 to +85
Operating Freq (Max) (MHz)	400
Ethernet speed	10M/100M
Ethernet (ch)	1
EtherCat (ch) (#)	0
USB FS (host ch/device ch)	( 0 / 0 )
USB HS (host ch/device ch)	( 2 / 2 )
USB SS (host ch/device ch)	( 0 / 0 )
PCI Express (generation and ch)	No
SCI or UART (ch)	5
SPI (ch)	3
I2C (#)	4
CAN (ch)	2
CAN-FD (ch)	0
Wireless	No
SDHI (ch)	2
High Resolution Output Timer	No
PWM Output (pin#)	16
32-Bit Timer (ch)	2
16-Bit Timer (ch) (#)	5
8-Bit Timer (ch)	0
Standby operable timer	No
Asynchronous General Purpose Timer / Interval Timer (ch)	0
16-Bit A/D Converter (ch)	0
14-Bit A/D Converter (ch)	0
12-Bit A/D Converter (ch)	8
10-Bit A/D Converter (ch)	0
24-Bit Sigma-Delta A/D Converter (ch)	0
16-Bit D/A Converter (ch)	0
12-Bit D/A Converter (ch)	0
10-Bit D/A Converter (ch) (#)	0
8-Bit D/A Converter (ch)	0
Capacitive Touch Sensing Unit (ch)	0
Graphics LCD Controller	Yes
MIPI Interfaces (DSI) (ch)	0
MIPI Interfaces (CSI) (ch)	0
Image Codec	No
Segment LCD Controller	No
Security & Encryption	No

Package Options

Pkg. Type	Pkg. Dimensions (mm)	Lead Count (#)	Pitch (mm)
LFBGA	8 x 8 x 1.4	176	0.5
LFQFP	24 x 24 x 1.7	176	0.5
LQFP	28 x 28 x 1.7	208	0.5

Applications

Home Appliance
Healthcare
Security

Part Number	Status	Samples	Longevity	Stock	Package	Budgetary Price (USD)	Carrier Type	Family Name	Series Name	Group Name	CPU Architecture	Main CPU	Sub CPU	Floating Point Unit	Bit Length	RAM (KB)	ECC SRAM	Lead Count (#)	Pitch (mm)	Pkg. Dimensions (mm)	Number of Supply Voltage(s) (#)	Supply Voltage (V)	I/O Ports	DMAC or DTC	DMA (ch)	Power-On Reset	Watchdog Timer (ch)	External Memory Bus (bit)	DRAM I/F	NPU	3D GPU	Accelerator	MOQ	Temp. Range (°C)	External Interrupt Pins (#)	LVD or PVD	Operating Freq (Max) (MHz)	Sub-clock (32.768 kHz)	On-chip Oscillator	Ethernet speed	Ethernet (ch)	USB Ports (#)	USB FS (host ch/device ch)	USB HS (host ch/device ch)	USB SS (host ch/device ch)	PCI Express (generation and ch)	SCI or UART (ch)	SPI (ch)	QSPI (ch)	OSPI (ch)	I2C (#)	CAN (ch)	Wireless	IrDA	LIN (#)	SDHI (ch)	High Resolution Output Timer	PWM Output (pin#)	32-Bit Timer (ch)	16-Bit Timer (ch) (#)	Standby operable timer	RTC	12-Bit A/D Converter (ch)	Graphics LCD Controller	Camera I/F (Parallel)	Image Codec	2D Drawing Engine	Segment LCD Controller	SSI (ch)	Security & Encryption	Debug Interface	Moisture Sensitivity Level (MSL)	Country of Assembly	Country of Wafer Fabrication
R7S721020VCBG#AC1	Active	Available		In Stock	LFBGA	1ku \| $7.67	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	8 x 8 x 1.4	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721020VCBG#BC1	Active	Available	2036 Mar	Out of Stock	LFBGA	1ku \| $7.67	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	8 x 8 x 1.4	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	2871	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721020VCFP#AA1	Active	Available		Out of Stock	LFQFP	1ku \| $8.26	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721020VCFP#BA1	Active	Available	2036 Mar	Out of Stock	LFQFP	1ku \| $8.26	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	320	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721021VCFP#AA1	Active	Available	2036 Mar	Out of Stock	LFQFP	1ku \| $9.61	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721021VCFP#BA1	Active	Available		Out of Stock	LFQFP	1ku \| $9.61	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	240	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721020VLFP#AA1	NRND	N/A		Out of Stock	LFQFP		Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3
R7S721021VLFP#AA1	NRND	N/A		In Stock	LFQFP	1ku \| $46.79	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN

Filters

Document
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Handbook
RECOMMENDED
PDF 276 KB R01TB0145EJ0100 Rev.1.00 May 21, 2026
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1L, RZ/A1LU, and RZ/A1LC.
Guide
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 Mar 12, 2026
Technical Update
RZ/A Series: Note about IRQ Interrupt request register erroneous clear of Interrupt Controller.
PDF 139 KB TN-RZ*-A0151A/E 日本語 Jan 08, 2026
Brochure
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 Oct 01, 2025
Product Change Notice
Package assembly site addition for RZ/A1L (208pinLQFP) (EPPO-EX-25-0019-1)
PDF 338 KB EPPO-EX-25-0019-1(r) 日本語 Jun 23, 2025
Product Change Notice
Adding of Cu bonding wire product for RZ/A1L group (EPPO-EX-25-0016-1)
PDF 109 KB EPPO-EX-25-0016-1 日本語 Jun 11, 2025
Datasheet
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Datasheet
RECOMMENDED
PDF 3.71 MB R01DS0480EJ0100 Rev.1.00 Dec 25, 2024
Product Advisory
Addition of full carton packaging for MPU products (RZ/A, RZ/T, RZ/N) (PC-MCU-A032A/E)
PDF 301 KB PC-MCU-A032A/E 日本語 Oct 24, 2024
Manual - Hardware
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group User's Manual: Hardware
RECOMMENDED
PDF 32.08 MB R01UH0437EJ0700 Rev.7.00 日本語 Sep 30, 2024
The RZ/A1LU, RZ/A1L, and RZ/A1LC groups are entry- to mid-range MPUs for HMI applications, featuring an Arm® Cortex®-A9 core (400 MHz) and up to 3 MB of on-chip RAM. With functions optimized for HMI control, these devices are well suited to low-cost and compact HMI equipment. The RZ/A1LU, RZ/A1L, and RZ/A1LC groups hardware manual describes the A9 core subsystem, LCD control, JPEG codec, peripheral interfaces, and related features, providing the information required to design HMI systems that effectively utilize the on-chip RAM.
Application Note
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 Sep 13, 2024
AI-generated Summary: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
Product Change Notice
Addition of a Wafer production site for RZ/A1L group (EPMP-IMB-23-0013-1)
PDF 97 KB EPMP-IMB-23-0013-1 日本語 Feb 02, 2023
Technical Update
RZ/A Series: Notes about capture address and capture horizontal size of Capture Engine Unit
PDF 207 KB TN-RZ*-A0103A/E 日本語 Dec 27, 2022
Flyer
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 Aug 05, 2022
Application Note
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 Jun 28, 2022
AI-generated Summary: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
Application Note
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 Jun 15, 2022
AI-generated Summary: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.

Datasheets (1)

Datasheet
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Datasheet
RECOMMENDED
PDF 3.71 MB R01DS0480EJ0100 Rev.1.00 Dec 25, 2024

Manuals & Guides (2)

Guide
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 Mar 12, 2026
Manual - Hardware
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group User's Manual: Hardware
RECOMMENDED
PDF 32.08 MB R01UH0437EJ0700 Rev.7.00 日本語 Sep 30, 2024
The RZ/A1LU, RZ/A1L, and RZ/A1LC groups are entry- to mid-range MPUs for HMI applications, featuring an Arm® Cortex®-A9 core (400 MHz) and up to 3 MB of on-chip RAM. With functions optimized for HMI control, these devices are well suited to low-cost and compact HMI equipment. The RZ/A1LU, RZ/A1L, and RZ/A1LC groups hardware manual describes the A9 core subsystem, LCD control, JPEG codec, peripheral interfaces, and related features, providing the information required to design HMI systems that effectively utilize the on-chip RAM.

Application Notes & White Papers (7)

Application Note
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 Sep 13, 2024
AI-generated Summary: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
Application Note
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 Jun 28, 2022
AI-generated Summary: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
Application Note
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 Jun 15, 2022
AI-generated Summary: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.
Application Note
Integrated Development Environment e² studio: How to use EGit in e² studio Rev.1.01
PDF 1.79 MB R20AN0523EE0101 Rev.1.01 日本語 Jul 26, 2021
AI-generated Summary: This section explains how to install and configure EGit within the e² studio environment. It details selecting Git integration during e² studio installation, updating EGit via the Help menu, and adding the EGit update repository. The guide also covers setting user identification for Git commits by configuring user name and email in the preferences. Finally, it describes opening the EGit perspective to start using Git features within e² studio.
Application Note
RZ/A1 Guidelines for High-Speed USB2.0 Board Design
PDF 413 KB R01AN5119EJ0120 Rev.1.20 日本語 May 26, 2020
AI-generated Summary: Guidelines for designing High-Speed USB 2.0 circuit boards focus on ensuring signal integrity and proper impedance control for 480 Mbps communication. Key points include maintaining a differential impedance of 90 Ω ± 15%, limiting wiring length to 300 mm for host controllers and 100 mm for function controllers, and ensuring minimal length difference between D+ and D- lines (2.5 mm or less). The USB transmission lines must be routed on a single layer without vias, separated from noisy signals, and surrounded by a ground guard ring spaced at least three times the D+/D- line spacing. Power supply pins and USB module pin functions are detailed for proper hardware design. The document also covers layout recommendations such as gentle turns in wiring and ground plane requirements.

View More (7)

Marketing Collateral (2)

Brochure
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 Oct 01, 2025
Flyer
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 Aug 05, 2022

Other (1)

Document
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Handbook
RECOMMENDED
PDF 276 KB R01TB0145EJ0100 Rev.1.00 May 21, 2026
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1L, RZ/A1LU, and RZ/A1LC.

Partner Boards & Kits

Complementary Silicon Devices

DRAM & Flash Memory Solutions

Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).

Provided By:

Winbond Electronics Corp. Japan

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RTOS MPU with 3MB of On-chip RAM

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