パッケージ情報
| CADモデル: | View CAD Model |
| Pkg. Type: | HVQFN |
| Pkg. Code: | pkg_1145 |
| Lead Count (#): | 56 |
| Pkg. Dimensions (mm): | 8 x 8 x 0.95 |
| Pitch (mm): |
環境及び輸出分類情報
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | |
| HTS (US) |
製品スペック
| Lead Count (#) | 56 |
| Carrier Type | Embossed Tape |
| Pb (Lead) Free | Yes |
| Lead Compliant | No |
| Length (mm) | 8 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 1 |
| Mounting Type | Surface Mount |
| Pkg. Dimensions (mm) | 8 x 8 x 0.95 |
| Pkg. Type | HVQFN |
| Qualification Level | Industrial |
| Tape & Reel | No |
| Thickness (mm) | 0.95 |
| Width (mm) | 8 |
R2J20605ANP に関するリソース
説明
Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
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