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Complete Current Share 10A DC/DC Power Module

パッケージ情報

CADモデル: View CAD Model
Pkg. Type: Module
Pkg. Code: YGE
Lead Count (#): 23
Pkg. Dimensions (mm): 15.0 x 15.0 x 2.20
Pitch (mm): 1.1

環境及び輸出分類情報

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Exempt
ECCN (US)
HTS (US)

製品スペック

Lead Count (#) 23
Carrier Type Reel
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Exempt
Pb Free Category Pb-Free 100% Matte Tin Plate w/Anneal-e3
Temp. Range (°C) -40 to +85°C
Configuration Normal
Control Type Voltage Mode
Current Sharing Yes
Digital Bus No
Input Voltage (Max) (V) 20
Input Voltage (Min) (V) 4.5
Length (mm) 15
MOQ 1000
Output Current (Max) [Rail 1] (A) 10
Output Voltage (Max) (V) 6
Output Voltage (Min) (V) 0.6
POR Yes
Parametric Category Analog-Interface Power Modules
Peak Efficiency (%) 94
Pitch (mm) 1.1
Pkg. Dimensions (mm) 15.0 x 15.0 x 2.20
Pkg. Type Module
Price (USD) $13.338
Pvin (Max) 20
Pvin (Min) 3
Qualification Level Standard
Quiescent Current 36 mA
SYNCH Capability Yes
Switching Frequency (KHz) 1.5 - 1.5
Thickness (mm) 2.2
Width (mm) 15

説明

The ISL8200AM is a simple and easy to use high power, current-sharing DC/DC power module for datacom, telecom, and FPGA power hungry applications. All that is needed is the ISL8200AM, a few passive components, and one VOUT setting resistor to have a complete 10A design ready for market. The ease of use practically eliminates design and manufacturing risks while dramatically improving time to market. Parallel up to six ISL8200AM modules to scale up to a 60A solution for more output current. The simplicity of the ISL8200AM is in its “off-the-shelf”, unassisted implementation compared to a discrete implementation. Patented current sharing in multiphase operation greatly reduces ripple currents, BOM cost, and complexity. For example, parallel two devices for 20A of current and up to six for 60A of current. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200AM’s thermally enhanced, compact QFN package operates at full load and over-temperature without requiring forced air cooling. The package is so thin it can even fit on the backside of the PCB. Easy access to all pins with few external components reduces the PCB design to a component layer and a simple ground layer.