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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation) - 6月はプライド月間として、LGBTQ+の権利や文化、コミュニティについて啓発する世界的な活動月間です

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:CERDIP
Pkg. Code:FGA
Lead Count (#):22
Pkg. Dimensions (mm):27.2 x 9.7 x 0.00
Pitch (mm):2.5

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeNo
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeCERDIP
Lead Count (#)22
Carrier TypeTube
Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeNo
Pb Free CategoryHot Solder Dip
MOQ136
Temp. Range (°C)-55 to +125°C
CAGE code34371
Length (mm)27.2
Pitch (mm)2.5
Pkg. Dimensions (mm)27.2 x 9.7 x 0.00
Qualification LevelClass Q
RatingMIL-STD-883
Width (mm)9.7

説明

The HM-6551/883 is a 256 x 4 static CMOS RAM fabricated using self-aligned silicon gate technology. Synchronous circuit design techniques are employed to achieve high performance and low power operation. On chip latches are provided for address and data outputs allowing efficient interfacing with microprocessor systems. The data output buffers can be forced to a high impedance state for use in expanded memory arrays. The HM-6551/883 is a fully static RAM and may be maintained in any state for an indefinite period of time. Data retention supply voltage and supply current are guaranteed over temperature.