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4 × 64Gbaud Linear Differential I/O Flip-Chip Driver

パッケージ情報

CADモデル: View CAD Model
Pkg. Type: WAFER
Pkg. Code: DICEW
Lead Count (#):
Pkg. Dimensions (mm): 0.0 x 0.0 x 0.0
Pitch (mm):

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.0090

製品スペック

Pkg. Type WAFER
Lead Count (#) 0
Carrier Type WFP
Pb (Lead) Free Yes
Pb Free Category e3 Sn
Temp. Range (°C) -5 to 105°C
Application 400/600Gbps 16/64QAM advanced multi-level modulation systems
Channels (#) 4
Data Rate Max (Gbps) 64
Function Linear Driver
MOQ 70
Output Type Differential
Output Voltage (V) 4V
Pkg. Dimensions (mm) 0.0 x 0.0 x 0.0
Qty. per Carrier (#) 0
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
掲載 No

説明

The GX76476-F is a low-power, high-performance, quad-channel linear flip-chip driver. It is designed for 400G/600G optical integrated transmitter small form factor (SFF) modules for metro and long-haul applications.

The GX76476-F integrates the quad lanes of the driver with serial peripheral interface (SPI) circuitry for DC controls on a single die. Each channel of the driver has a 100Ω differential AC-coupled input and 60Ω differential interface with an open-collector type output stage, and linear output voltage of 4.0Vppd suitable for silicon photonics modulator and multi-level modulations.