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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
Ultra-Low Power Stereo Codec with Single-Ended Headphone Driver

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:32-WLCSP
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm):4.56 x 1.98
Pitch (mm):0.55

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

製品スペック

Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
ADC SNR A-weighted support(dB) @ 48kHz105 @ 1.8V
Advanced Features5bd EQ, 3bd Sidetone, ALC, Noise gate, Beep generator
Audio Interface2-wire
DAC SNR A-weighted support(dB) @ 48kHz110 @ 1.8V
Headphone Power Output2 x 58mW @ 1.8V
MOQ7500
Pitch (mm)0.55
Pkg. Dimensions (mm)4.56 x 1.98
Pkg. Type32-WLCSP
Power Consumption During Playback4mW @ 1.8V
Power Consumption During Record2.5mW @ 1.8V
Price (USD)$2.24335
Qty. per Reel (#)7500
Temp. Range (°C)-40 to +85°C

説明

The DA7218 is a high-performance, low power audio codec optimized for use in portable applications or wearable devices. It has single-ended headphone outputs with headphone detect for use in accessories, offering excellent left to right channel separation and common mode noise rejection.

DA7218 also has a stereo DAC to headphone output path and ultra-low power operating modes to support always-on audio detect applications. It contains two analog microphone input paths, or up to four digital microphone input paths, or a combination of both. The other chip in this family, the DA7217 has differential headphone outputs without headphone detect, and has been designed for use inside headset devices.

Benefits

  • Superior hi-fidelity audio performance for immersive record and playback
  • Sub 500µW always-on power extends battery life for audio activity detection
  • Flexible programming filtering (sideband, voice) enhances voice and audio playback
  • Mixed sample rate support for wideband applications
  • Supports the latest generation of low power analog and digital microphones
  • Small package footprint with an optimized ballout conducive to low cost PCB manufacturing