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16K x 18 / 32K x 9 TeraSync FIFO, 2.5V

パッケージ情報

CADモデル: View CAD Model
Pkg. Type: PBGA
Pkg. Code: BB144
Lead Count (#): 144
Pkg. Dimensions (mm): 13.0 x 13.0 x 1.76
Pitch (mm): 1

環境及び輸出分類情報

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free No
ECCN (US)
HTS (US)

製品スペック

Carrier Type Tray
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 2.5
Density (Kb) 288
Family Name TeraSync
Function Bus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz) 225 - 225
I/O Type 1.5 V HSTL, 1.8 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
Interface Synchronous
Lead Count (#) 144
Length (mm) 13
MOQ 10
Moisture Sensitivity Level (MSL) 3
Organization 16K x 18, 32K x 9
Package Area (mm²) 169
Pb (Lead) Free No
Pb Free Category e0
Pitch (mm) 1
Pkg. Dimensions (mm) 13.0 x 13.0 x 1.76
Pkg. Type PBGA
Qty. per Carrier (#) 160
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.76
Width (mm) 13
掲載 No

説明

The 72T1875 is a 16K x 18 / 32K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.