The ISL6307 controls microprocessor core voltage regulation by driving up to 6 synchronous-rectified buck channels in parallel. Multiphase buck converter architecture uses interleaved timing to multiply channel ripple frequency and reduce input and output ripple currents. Lower ripple results in fewer components, lower component cost, reduced power dissipation, and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates. The ISL6307 features a high bandwidth control loop and ripple frequencies up to 6MHz to provide optimal response to the transients. today's microprocessors require a tightly regulated output voltage position versus load current (droop). The ISL6307 senses current by utilizing patented techniques to measure the voltage across the on resistance, RDS(ON), of the lower MOSFETs or DCR, of the output inductor during the lower MOSFET conduction intervals. Current sensing provides the needed signals for precision droop, channel-current balancing, and overcurrent protection. A programmable internal temperature compensation function is implemented to effectively compensate for the temperature coefficient of the current sense element. A unity gain, differential amplifier is provided for remote voltage sensing. Any potential difference between remote and local grounds can be completely eliminated using the remote-sense amplifier. Eliminating ground differences improves regulation and protection accuracy. The thresholdsensitive enable input is available to accurately coordinate the start up of the ISL6307 with any other voltage rail. Dynamic-VID™ technology allows seamless on-the-fly VID changes. The offset pin allows accurate voltage offset settings that are independent of VID setting.

特長

  • Precision Multiphase Core Voltage Regulation
  • Differential Remote Voltage Sensing
  • ±0.5% System Accuracy Over Life, Load, Line and Temperature
  • Adjustable Precision Reference-Voltage Offset
  • Precision RDS(ON) or DCR Current Sensing
  • Accurate Load-Line Programming
  • Accurate Channel-Current Balancing
  • Differential Current Sense
  • Microprocessor Voltage Identification Input
  • Dynamic VID™ Technology
  • 8-Bit VID Input with Selectable VR11 Code and Extended VR10 Code at 6.25mV Step
  • 0.5V to 1.600V operation range
  • Threshold-Sensitive Enable Function for Power Sequencing and VTT Enable
  • Thermal Monitoring
  • Programmable Temperature Compensation
  • Overcurrent Protection
  • Overvoltage Protection with OVP Output Indication
  • 2, 3, 4, 5 or 6 Phase Operation
  • Adjustable Switching Frequency up to 1MHz per Phase
  • QFN Package Option
  • QFN Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline
  • QFN Near Chip Scale Package Footprint; Improves PCB Efficiency, Thinner in Profile
  • Pb-Free Plus Anneal Available (RoHS Compliant)

製品選択

製品名 Part Status Pkg. Type Carrier Type MOQ 購入/サンプル
Last Time Buy QFN Tube 43
Availability
Last Time Buy QFN Reel 4000
Availability

ドキュメント

タイトル language 分類 形式 サイズ 日付
データシート
ISL6307 Datasheet データシート PDF 1.49 MB
アプリケーションノート、ホワイトペーパー
AN1681: Grounding Techniques アプリケーションノート PDF 509 KB
AN1684: Nonideality of Ground アプリケーションノート PDF 397 KB
Five Easy Steps to Create a Multi-Load Power Solution ホワイトペーパー PDF 846 KB
PCN / PDN
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II 製品変更通知 PDF 398 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products 製品変更通知 PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal 製品変更通知 PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump 製品変更通知 PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia 製品変更通知 PDF 248 KB
その他資料
PLC20036 - 2H EOL 2020 Product Life Cycle Notice PDF 319 KB