Renesas' bipolar transistors are suitable for a variety of applications such as large current applications and amplifiers, and for support in customers' systems. A comprehensive lineup of small and ultra-small packages is available, as well as dual products that take up little space and other composite products. Renesas' transistors have a built-in resistor in the base or between the base and the emitter, enabling the reduction in mounting area and the number of parts used. Additionally, these devices can be used at high temperatures (up to 175 °C) and offer high power and low Vce (sat).

descriptionDocumentation

Title language Type Format File Size Date
Renesas Semiconductor Lead-Free Packages
Brochure
PDF 1.32 MB
Semiconductor Reliability Handbook 日本語
General Reliability Literature
PDF 14.70 MB
Semiconductor Package Mount Manual 日本語, 简体中文
Other
PDF 10.28 MB
Small Signal Transistor Precautions and Disclaimers
Other
PDF 135 KB
Small Signal Transistor Type Designation
Other
PDF 52 KB
Small Sugnal Transistor Technical Symbols and Its Definitions
Other
PDF 96 KB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語
Product Change Notice
PDF 4.86 MB
Addition of another type of the Reel (12mm width) with High Frequency Transistors 日本語
Product Change Notice
PDF 143 KB
Added the packing specification of non-reel for RF & Microwave transistor 日本語
Technical Update
PDF 131 KB
Changes of the shipping forms and materials by applying the unified packing specification 日本語
Technical Update
PDF 695 KB
Change of the die bonding material 日本語
Technical Update
PDF 119 KB
Inner box change according to dampproof bag change and dampproof bag change 日本語
Technical Update
PDF 3.10 MB
Standardization of moisture-proof aluminum bags and addition of drying agent specifications (expansion of target products) 日本語
Technical Update
PDF 324 KB
Change of inner packing label 日本語
Technical Update
PDF 343 KB
Addition of Production Line for MPAK 日本語
Technical Update
PDF 214 KB
PCN of Marking for Power Transistors 日本語
Technical Update
PDF 92 KB
Change of content printed on the side of inner box 日本語
Technical Update
PDF 31 KB
Addition of Shipping Tray Type for LQFP2020 Packages 日本語
Technical Update
PDF 126 KB
Change of Carrier Tape Material *Change from polyvinyl chloride (PVC) to polystyrene (PS). 日本語
Technical Update
PDF 41 KB
Change of the marking on UPAK transistors and FETs 日本語
Technical Update
PDF 88 KB
Changing the plating composition on the lead terminals (Lead-free) 日本語
Technical Update
PDF 28 KB

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