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AE-CLOUD1 enables rapid evaluation, prototyping and development of cloud connected applications. It features the S5D9 microcontroller (MCU) Group, the superset of the S5 MCU series.

Kit Contents

  • S5D9 MCU board
  • 802.11 b/g/n Wi-Fi board
  • Segger J-Link® Lite for Renesas Synergy™
  • 2 x A male to Micro-B male 1ft USB cables.

Useful Links

System Requirements

Target Device

Knowledge Base

Features

The Renesas Synergy™ AE-CLOUD1 enables rapid evaluation, prototyping and development of cloud connected applications using the Synergy Platform.

Cloud Services

The AE-CLOUD1 kit with the Cloud Connectivity Application Projects can help you quickly connect to the cloud service of your choice.

descriptionDocumentation

Title language Type Format File Size Date
User Guides & Manuals
star Application Example for Cloud Connectivity (AE-CLOUD1) User's Manual 日本語 Manual - Development Tools PDF 1.50 MB
Application Notes & White Papers
Synergy MQTT/TLS AWS Cloud Connectivity Solution - Application Project
Related Files: Sample Code
日本語 Application Note PDF 1.78 MB
Synergy MQTT/TLS Azure Cloud Connectivity Solution - Application Project
Related Files: Sample Code
日本語 Application Note PDF 1.04 MB
Synergy MQTT/TLS Google Cloud Connectivity Solution - Application Project
Related Files: Sample Code
日本語 Application Note PDF 1.32 MB
Renesas Synergy™ Platform Pin Configurator Usage 日本語 Application Note PDF 2.27 MB
Renesas Synergy™ Project Import Guide - Application Note 日本語 Application Note PDF 1.71 MB
Creating a Custom Board Support Package for SSP 1.1.z - Application Project
Related Files: Sample Code
Application Note PDF 439 KB

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