Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | SO8-FL |
| Pkg. Code: | |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 5.15 x 6.10 x 1.00 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) | 8541.29.0095 |
| RoHS (RBA175N08EANS-4UA02#HB0) | EnglishJapanese |
Product Attributes
| Pkg. Type | SO8-FL |
| Lead Count (#) | 8 |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Channels (#) | 1 |
| Ciss (Typical) (pF) | 6600 |
| Country of Assembly | MALAYSIA |
| Country of Wafer Fabrication | JAPAN |
| Function | Power MOSFETs |
| Gate Level | Standard |
| ID (A) | 175 |
| Id max @ 25°C (A) | 175 |
| Lead Compliant | No |
| Length (mm) | 6.1 |
| MOQ | 5000 |
| Mounting Type | Surface Mount |
| Nch/Pch | Nch |
| Pch (W) | 165 |
| Pkg. Dimensions (mm) | 5.15 x 6.10 x 1.00 |
| Qg typ (nC) | 99 |
| Qualification Level | Automotive |
| RDS (ON) (Max) @10V (mohm) | 2.4 |
| RDS (ON) (Typical) @ 10V / 8V (mohm) | 2.1 |
| Series Name | REXFET-1 |
| Simulation Model Available | Yes |
| Standard Pkg. Type | SO8-FL 5x6 BSC |
| Tape & Reel | Yes |
| Thickness (mm) | 1 |
| VDSS (Max) (V) | 80 |
| VGSS (V) | 20 |
| Vgs (off) (Max) (V) | 4 |
| Width (mm) | 5.15 |
Resources for RBA175N08EANS-4UA02
Description
The RBA175N08EANS-4UA02 N-channel power MOSFET features REXFET-1 split-gate technology and is offered in a 5x6 SO8-FL package. The SO8-FL package features ultra-compact, leadless designs with Wettable Flanks to support enhanced thermal performance, reliability, and ease of assembly.
Renesas' REXFET-1 split-gate technology is well-suited for applications that require low RDS(on) and switching capability, making it ideal for high-power and high-frequency applications.
