Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | HVQFN |
| Pkg. Code: | |
| Lead Count (#): | 40 |
| Pkg. Dimensions (mm): | 6 x 6 x 0.8 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| RoHS (R9A06G062GNP#AC1) | EnglishJapanese |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | HVQFN |
| Lead Count (#) | 40 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| CPU | - |
| Data Flash (KB) | 0 |
| Lead Compliant | Yes |
| Length (mm) | 6 |
| MOQ | 1 |
| Modulation | OFDM, FSK |
| Pkg. Dimensions (mm) | 6 x 6 x 0.8 |
| Price (USD) | $8.71641 |
| Program Memory (KB) | 0 |
| Supply Voltage (V) | 2.7 - 3.6 |
| Tape & Reel | No |
| Thickness (mm) | 0.8 |
| Width (mm) | 6 |
Resources for R9A06G062GNP
Description
The R9A06G062GNP delivers Sub-GHz wireless communication with OFDM and FSK modulations compliant with IEEE 802.15.4-2020 and Wi-SUN FAN1.1 profile; OFDM modulation provides high speed and robust communication for IoT devices, while FSK modulation ensures compatibility with the conventional FAN1.0 profile, making the R9A06G062GNP an essential product for IoT networks.
The R9A06G062GNP is ideal for wireless communication applications in a wide range of IoT devices including smart meters and sensor networks within the 863MHz to 928MHz band.
