Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | FCBGA |
| Pkg. Code: | |
| Lead Count (#): | 508 |
| Pkg. Dimensions (mm): | |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| Pb (Lead) Free | |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Lead Count (#) | 508 |
| 3D GPU | GE7800, D/AVE-HD |
| Accelerator | IMR |
| Application Core | 2 x Cortex A57 |
| Auto I/F | 2x CAN 2.0B, 2x CAN FD |
| CPU | Cortex-A57 x 2, Cortex-R7 x 1 |
| Computer Vision / Frequency | No |
| DDR Interface | 1x 32-bit LPDDR4-3200 |
| Deep Learning (TOPS) | No |
| Ethernet | 1x Gbit Standart Port |
| Flash Interface | Parallel Serial Flash, 1x eMMC 4x SDIO |
| High Speed | 1x PCIe 2.0 |
| Highest ASIL Level | QM, Up to ASIL B |
| Key Features | 11x UART, 4x SPI, 7x I2C, USB, MOST, Security, JTAG |
| Parametric Applications | Cluster/IVI |
| Pitch (mm) | 0.65 |
| Pkg. Type | FCBGA |
| Real Time Core Freq / KDMIPS | Cortex R7 |
| Temp. Range (°C) | -40 to +105°C |
| Video Codec | Video HW codec |
| Video Input | 2x Digital 1x MIPI-CSI2 |
| Video Output | Digital Out LVDS |
Resources for R-Car-M3Le
Description
The R-Car M3Le automotive system-on-chip (SoC) for medium-class automotive computing systems can be used in a wide range of automotive applications requiring medium-class computing, including digital cluster, in-vehicle infotainment (IVI), connected gateway, and central server. The M3Le extends the R-Car Gen3 SoC portfolio into the entry-level segment with optimized functionality. The cost-efficient M3Le device is hardware- and software-compatible with the R-Car M3Ne and can be used in cost-reduction programs based on M3Ne. The R-Car M3Le is compliant with the ISO 26262 (ASIL B) functional safety standard for automotive and has enhanced security functions.
