Features
- Fully Integrated Protection Circuit for Three Protected Variables
- High Accuracy Protection Thresholds
- User Programmable Overcurrent Protection Threshold
- Input Overvoltage Protection in Less Than 1µs
- High Immunity of False Triggering Under Transients
- Warning Output to Indicate the Occurrence of Faults
- Enable Input
- Easy to Use
- Thermal Enhanced TDFN Package
- Pb-Free (RoHS Compliant)
Description
The ISL9209C is an integrated circuit (IC) optimized to provide a redundant safety protection to a Li-ion battery from failures of a charging system. The IC monitors the input voltage, the battery voltage, and the charge current. When any of the three parameters exceeds its limit, the IC turns off an internal P-Channel MOSFET to remove the power from the charging system. In addition to the above protected parameters, the IC also monitors its own internal temperature and turns off the P-Channel MOSFET when the temperature exceeds +140°C. Together with the battery charger IC and the protection module in a battery pack, the charging system using the ISL9209C has triple-level protection and is two-fault tolerant. The IC is designed to turn on the internal PFET slowly to avoid in-rush current at power-up but will turn off the PFET quickly when the input is overvoltage in order to remove the power before any damage occurs. The ISL9209C has a logic warning output to indicate the fault and an enable input to allow the system to remove the input power.
Applications
- Cell Phones
- Digital Still Cameras
- PDAs and Smart Phones
- Portable Instruments
- Desktop Chargers
| Part Number | Status | Samples | Stock | RoHS | Package | Carrier Type | MOQ |
|---|---|---|---|---|---|---|---|
| ISL9209CIRZ | Obsolete | N/A | In Stock | RoHS:EN | TDFN | Tube | 3000 |
| ISL9209CIRZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TDFN | Reel | 6000 |
Filters
Applied Filters
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Product Change NoticePDF 248 KB PCN10055 Jun 30, 2010
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 1.17 MB TB389 Mar 07, 2024
- DocumentPDF 653 KB tb379 May 25, 1999
- DocumentPDF 293 KB tb363 May 04, 2018
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 398 KB PCN15046 Jan 07, 2016
- Product Change NoticePDF 248 KB PCN10055 Jun 30, 2010
Product Notices (PCN, EOL, etc) (4)
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- DocumentPDF 1.17 MB TB389 Mar 07, 2024
- DocumentPDF 293 KB tb363 May 04, 2018
- DocumentPDF 653 KB tb379 May 25, 1999
Other (3)
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