Features
- This Circuit is Processed in Accordance to MIL-STD- 883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
- Low Power Standby and Operating Power
- ICCSB 100µA
- ICCOP 20mA at 1MHz
- Fast Access Time 120/200ns
- Wide Operating -55°C to +125°C
- Temperature Range
- Industry Standard Pinout
- Single 5.0V Supply
- CMOS/TTL Compatible Inputs
- Field Programmable
- Synchronous Operation
- On-Chip Address Latches
- Separate Output Enable
Description
The HM-6642/883 is a 512 x 8 CMOS NiCr fusible link Programmable Read Only Memory in the popular 24 pin, byte wide pinout. Synchronous circuit design techniques combine with CMOS processing to give this device High-Speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with recent generation microprocessors that use multiplexed address/data bus structures, such as the 8085. The output enable controls, both active low and active high, further simplify microprocessor system interfacing by allowing output data bus control independent of the chip enable control. The data output latches allow the use of the HM-6642/883 in High-Speed pipelined architecture systems, and also in synchronous logic replacement functions. Applications for the HM-6642/883 CMOS PROM include low power hand held microprocessor based instrumentation and communications systems, remote data acquisition and processing systems, processor control store, and synchronous logic replacement. All bits are manufactured storing a logical "0" and can be selectively programmed for a logical "1" at any bit location.
Parameters
| Attributes | Value |
|---|---|
| Rating | MIL-STD-883 |
| Temp. Range (°C) | -55 to +125°C |
| Flow | Harsh Environment & MIL-STD-883 |
| Qualification Level | Class Q |
| Die Sale Availability? | No |
| PROTO Availability? | No |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| SBDIP | 30.5 x 15.1 x 2.41 | 24 | 2.5 |
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) | CAGE code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HM1-6642B/883 | Active | Available | Out of Stock | SBDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 90 | -55 to +125°C | 34371 |
| 5962-8869002JA | Obsolete | N/A | Out of Stock | SBDIP | 24# | Tube | Not Applicable | No | Hot Solder Dip | 60 | -55 to +125°C | 34371 |
Filters
Applied Filters
- Product Change NoticePDF 260 KB PCN16087 Sep 30, 2016
- End Of Life NoticePDF 200 KB PLC15033 Jun 11, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014
- Product Change NoticePDF 138 KB PCN11042 Apr 07, 2011
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Application Notes & White Papers (1)
- Product Change NoticePDF 260 KB PCN16087 Sep 30, 2016
- End Of Life NoticePDF 200 KB PLC15033 Jun 11, 2015
- Product Change NoticePDF 174 KB PCN14017 Apr 21, 2014View More (6)
Product Notices (PCN, EOL, etc) (6)
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