Pitch (mm) | 0.8 |
Lead Count (#) | 8 |
Pkg. Dimensions (mm) | 3.99 x 3.99 x 0.90 |
Pkg. Code | LKF |
Pkg. Type | DFN |
Moisture Sensitivity Level (MSL) | 3 |
Pb (Lead) Free | Yes |
ECCN (US) | EAR99 |
RoHS (HIP2211FR8Z-T) | Download |
HTS (US) |
Lead Count (#) | 8 |
Carrier Type | Reel |
Moisture Sensitivity Level (MSL) | 3 |
Pkg. Dimensions (mm) | 4.0 x 4.0 x 0.90 |
Pitch (mm) | 0.8 |
Pb (Lead) Free | Yes |
Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
Temp. Range | -40 to +125°C |
Country of Assembly | Malaysia |
Country of Wafer Fabrication | Taiwan |
Bootstrap Supply Voltage (Max) (V) | 115 |
Charge Pump | No |
Fall Time | 20 |
Input Logic Level | 3.3V/TTL |
Length (mm) | 4 |
Longevity | 0000 Jul |
MOQ | 6000 |
Parametric Category | Half-Bridge FET Drivers |
Peak Pull-down Current (A) | 4 |
Peak Pull-up Current (A) | 3 |
Pkg. Type | DFN |
Qualification Level | Standard |
Rise Time (μs) | .020 |
Simulation Model Available | iSim |
Thickness (mm) | 0.9 |
Turn-Off Prop Delay (ns) | 15 |
Turn-On Prop Delay (ns) | 15 |
VBIAS (Max) (V) | 18 |
Width (mm) | 4 |
The HIP2211 is a 100V, 3A source, 4A sink high-frequency half-bridge NMOS FET driver. The HIP2211 features standard HI/LI inputs and is pin-compatible with popular Renesas bridge drivers such as the HIP2101 and ISL2111. Its wide operating supply range of 6V to 18V and integrated high-side bootstrap diode supports driving the high-side and low-side NMOS in 100V half-bridge applications.
This driver features a strong 3A source, 4A sink driver with very fast 15ns typical propagation delay and 2ns typical delay matching, making it optimal for high-frequency switching applications. VDD and boot UVLO protects against an undervoltage operation.
The HIP2211 is offered in 8 Ld SOIC, 8 Ld 4x4mm DFN, and 10 Ld 4x4mm TDFN packages.