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Microcontrollers for Mobile Device Applications

Package Information

CAD Model:View CAD Model
Pkg. Type:QFP
Pkg. Code:pkg_775
Lead Count (#):100
Pkg. Dimensions (mm):20 x 14 x 3.1
Pitch (mm):0.65

Environmental & Export Classifications

RoHS (DF2280F20BJV)EnglishJapanese
Moisture Sensitivity Level (MSL)
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

CPUH8S/2000
Bit Size16
RAM (KB)2
Program Memory (KB)64
Lead Count (#)100
Operating Freq (Max) (MHz)20
Timer16-bit x 3-ch
ADC10-bit x 8-ch
RTCYes
LVD or PVDNo
DMANo
EthernetNo
Temp. Range (°C)-40 to +85
Carrier TypeTray
Family NameH8S
Lead CompliantYes
Length (mm)20
MOQ1
Pb (Lead) FreeYes
Pkg. Dimensions (mm)20 x 14 x 3.1
Pkg. TypeQFP
Tape & ReelNo
Thickness (mm)3.1
Width (mm)14

Description

The H8S/2282, 2280 Group is supported only for customers who have already adopted these products. The RX113 Group is recommended for new designs.