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CD4503BMS

Obsolete

CMOS Hex Buffer

Features

  • High-voltage type (20V rating)
  • 3-state non-inverting type
  • 1 TTL load output drive capability
  • 2 output disable controls
  • 3 state outputs
  • Pin compatible with industry types MM80C97, MC14503 and 340097
  • 5V, 10V and 15V parametric ratings
  • Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
  • Meets all requirements of JEDEC tentative standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
CD4503BMS Functional Diagram
CD4503BMS Functional Diagram

Description

CD4503BMS is a hex noninverting buffer with 3 state outputs that have high sink and source current capability. Two disable controls are provided, one of which controls four buffers and the other controls the remaining two buffers. The CD4503BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E, Ceramic Flatpack H6W.

Applications

  • 3 state hex buffer for interfacing ICs with data buses
  • COS/MOS to TTL hex buffer
Part NumberStatusSamplesStockPackageLead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Pitch (mm)Pkg. Dimensions (mm)DLA SMDPb (Lead) FreePb Free CategoryMOQTemp. Range (°C)CAGE code
CD4503BDMSRObsoleteN/AOut of StockSBDIP16#TubeNot Applicable2.5mm20.3 x 7.5 x 2.415962R9664301VECExemptGold Plate over compliant Undercoat-e425-55 to +125°C34371
CD4503BKMSRObsoleteN/AOut of StockCFP16#TrayNot Applicable1.3mm10.4 x 6.9 x 0.005962R9664301VXCExemptGold Plate over compliant Undercoat-e425-55 to +125°C34371
CD4503BKNSRObsoleteN/AOut of StockCFP16#TrayNot Applicable1.3mm10.4 x 6.9 x 0.00ExemptGold Plate over compliant Undercoat-e425-55 to +125°C34371
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    Recommended Documents (1)

  1. Datasheet
    CD4503BMS Datasheet
    RECOMMENDED
    PDF 309 KB cd4503bms Aug 07, 1998

    Datasheets (1)

  1. Datasheet
    CD4503BMS Datasheet
    RECOMMENDED
    PDF 309 KB cd4503bms Aug 07, 1998

    Application Notes & White Papers (1)

  1. Application Note
    AN9654: Use of Life Tested Parts
    PDF 224 KB an9654 May 05, 1999
    AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.

    Marketing Collateral (1)

  1. Brochure
    Intersil Commercial Lab Services
    PDF 467 KB commercial-lab-services Sep 01, 2023
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