Features
- Single 1.7V - 2.0V supply
- 64Mbit (8 x 8Mbit) Flash memory
- Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) compatible
- Supports SPI modes 0 and 3
- Supports dual-output read and quad I/O program and read
- Supports QPI program and read
- 133MHz maximum operating frequency
- Clock-to-Output (tV1) of 6ns
- Up to 66MB/s continuous data transfer rate
- Quad enabled
- Full chip erase
- Flexible, optimized erase architecture for code and data storage applications
- 0.6ms typical Page Program (256 Bytes) time
- 60ms typical 4kByte Block Erase time
- 200ms typical 32kByte Block Erase time
- 350ms typical 64kByte Block Erase time
- Hardware-controlled locking of Status registers via WP pin
- 4kbit secured One-Time Programmable (OTP) security register
- Hardware write protection
- Serial Flash Discoverable Parameters (SFDP) register
- Flexible programming
- Byte/Page program (1 to 256 Bytes)
- Dual or quad input byte/page program (1 to 256 Bytes)
- Erase/Program suspend and resume
- JEDEC standard manufacturer and device ID read methodology
- Low power dissipation
- 2μA Deep Power-Down (DPD) current (typical)
- 10μA Standby current (typical)
- 5mA Active read current (typical)
- Endurance: 100,000 program/erase cycles (4kB, 32kB, or 64kB blocks)
- Data Retention: 20 years
- Industrial temperature range: -40°C to +85°C
- Industry standard green (Pb/Halide-free/RoHS-compliant) package options
- 8-pad DFN (6mm x 5mm x 0.6mm)
- 8-lead 208-mil SOIC
- 8-ball WLCSP
Description
The AT25QL641 is a member of our standard class code and data storage solutions designed for low-voltage systems in which program code is shadowed from Flash memory into embedded or external RAM for execution.
The architecture includes standard erase block sizes and a security register for unique device serialization, system-level Electronic Serial Number (ESN) storage, locked key storage, etc.
The AT25QL641 is Quad enabled at the factory and offers a universally compatible pinout and command set, standard block architecture, and continuous read, wrap, and burst modes for XiP.
| Part Number | Status | Stock | Package | Budgetary Price (USD) | Sample Catalog | Carrier Type | Moisture Sensitivity Level (MSL) | Country of Assembly |
|---|---|---|---|---|---|---|---|---|
| AT25QL641-DWF | Obsolete | Out of Stock | See Wafer-Die Solution Menu | <a href="https://www.renesas.com/samplecomponents/scripts/samplecenter/adestotech?cmd=menu" title="Request Samples" rel="noreferrer">Request Samples</a> | ||||
| AT25QL641-MHE-T | NRND | In Stock | DFN | 1ku | $1.12 | <a href="https://www.renesas.com/samplecomponents/scripts/samplecenter/adestotech?cmd=menu" title="Request Samples" rel="noreferrer">Request Samples</a> | Tape & Reel | 1 | TAIWAN |
| AT25QL641-SHE-T | NRND | In Stock | SOIC-W | 1ku | $1.03 | <a href="https://www.renesas.com/samplecomponents/scripts/samplecenter/adestotech?cmd=menu" title="Request Samples" rel="noreferrer">Request Samples</a> | Tape & Reel | 1 | TAIWAN |
| AT25QL641-SUE-T | Obsolete | Out of Stock | SOIC-W | Tape & Reel | 3 | |||
| AT25QL641-UUE-T | NRND | Out of Stock | WLCSP | 1ku | $0.82 | <a href="https://www.renesas.com/samplecomponents/scripts/samplecenter/adestotech?cmd=menu" title="Request Samples" rel="noreferrer">Request Samples</a> | Tape & Reel | 1 | PHILIPPINES |
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- Application NotePDF 884 KB R10AN0038EU0100 Rev.1.00 Mar 10, 2026This application note discusses endurance and data retention in NOR Flash memory products. It describes the structure and operation of the NOR Flash transistor, the mechanisms of NOR Flash device failure and oxide degradation which limit endurance and data retention. It explains JEDEC-based test procedures for certifying endurance and data retention specifications and ways to mitigate limitations. The first part of this document and the appendix provide background for understanding the issue. The later sections describe practical scenarios of interest to most customers.
- Application NotePDF 695 KB AN503 Sep 05, 2025Explores thermal resistance in integrated circuits (ICs) and details its role in managing heat from power consumption to ensure reliable operation. Proper thermal management enhances IC performance and longevity. Thermal resistance, measured in °C/W, quantifies heat flow resistance from the silicon die to the environment or PCB, with key types including junction-to-case (θJC), case-to-ambient (θCA), junction-to-ambient (θJA), and junction-to-board (θJB).
- Application NotePDF 2.62 MB AN500 Feb 13, 2024AI-generated Summary: NOR Flash memory requires an erase operation before programming, which occurs in three phases: Pre-Program, Erase, and Recovery. The erase process affects entire blocks simultaneously, not byte-by-byte. Memory cells use floating gate MOSFETs to store data, organized into arrays of rows (Word-Lines) and columns (Bit-Lines). Physical Blocks contain multiple Logical Blocks and share common p-wells and Bit-Lines, impacting operation. Smaller Logical Blocks enable improved erase performance through parallelization. Understanding these processes and potential interruptions is crucial for designing reliable systems.
- Application NotePDF 710 KB AN502 Jan 24, 2024AI-generated Summary: Renesas NOR flash devices require decoupling capacitors close to VCC and GND pins to stabilize voltage, typically 1 μF with an optional 100 nF capacitor. Pull-up resistors are recommended on CS#, WP#/IO2, and HOLD#/IO3 pins to ensure proper signal states and facilitate debugging. Signal routing should minimize trace length and maintain a solid ground plane for high-speed signals. Power supply must rise monotonically during power-up. Basic system bring-up involves verifying installation, voltage levels, and SPI communication using manufacturer/device ID commands. Software drivers depend on host MCU architecture; Renesas offers example drivers and support. Correct erase/program sequences include write-enable, erase/program commands, and status checks. Tools for programming include flash loader plug-ins and debug probes. Switching from single to quad-SPI involves setting the quad-enable bit, changing pin functions. Dummy cycles introduce necessary wait times during read commands to accommodate latency.
- GuidePDF 790 KB SPI_NOR_Flash_Product_Guide_PBFLASH03102022rev-C Jun 16, 2023
- Product Change NoticePDF 195 KB Mar 06, 2023
- DocumentPDF 1 MB R10DS0315EU0000 Rev.0.00 Jun 28, 2022
- Application NotePDF 794 KB May 12, 2022AI-generated Summary: Renesas NOR flash devices implement multiple protection methods to safeguard memory arrays, status registers, flash states, and resets from accidental or intentional modifications. Protection types include hardware-based write protection via the WP pin and software-based protection through commands controlling status registers and memory blocks. Memory array protection schemes include individual block protection, allowing sector-level lock/unlock, and memory edge protection, which protects contiguous regions aligned to memory edges. Status register protection indirectly secures memory by blocking changes to protection states. Detailed command sets and register bits configure these protections, ensuring robust flash memory integrity.
- Application NotePDF 663 KB Oct 18, 2021AI-generated Summary: Proper power-up and power-down sequencing is critical for NOR Flash memory operation to ensure reliable system performance. The power supply voltage must ramp up monotonically without dips, reaching the minimum operational voltage within specified timing to avoid corrupted initialization. Reset methods, including hardware and JEDEC resets, help ensure the device starts from a known state. Brown-out conditions and power cycling require careful handling to prevent data corruption and ensure stable operation. The document covers power sequencing, reset types, brown-out recovery, power-down, and power-saving modes, providing essential guidelines for system engineers and application developers.
Recommended Documents (1)
Datasheets (1)
- GuidePDF 790 KB SPI_NOR_Flash_Product_Guide_PBFLASH03102022rev-C Jun 16, 2023
Manuals & Guides (1)
- Application NotePDF 884 KB R10AN0038EU0100 Rev.1.00 Mar 10, 2026This application note discusses endurance and data retention in NOR Flash memory products. It describes the structure and operation of the NOR Flash transistor, the mechanisms of NOR Flash device failure and oxide degradation which limit endurance and data retention. It explains JEDEC-based test procedures for certifying endurance and data retention specifications and ways to mitigate limitations. The first part of this document and the appendix provide background for understanding the issue. The later sections describe practical scenarios of interest to most customers.
- Application NotePDF 695 KB AN503 Sep 05, 2025Explores thermal resistance in integrated circuits (ICs) and details its role in managing heat from power consumption to ensure reliable operation. Proper thermal management enhances IC performance and longevity. Thermal resistance, measured in °C/W, quantifies heat flow resistance from the silicon die to the environment or PCB, with key types including junction-to-case (θJC), case-to-ambient (θCA), junction-to-ambient (θJA), and junction-to-board (θJB).
- Application NotePDF 2.62 MB AN500 Feb 13, 2024AI-generated Summary: NOR Flash memory requires an erase operation before programming, which occurs in three phases: Pre-Program, Erase, and Recovery. The erase process affects entire blocks simultaneously, not byte-by-byte. Memory cells use floating gate MOSFETs to store data, organized into arrays of rows (Word-Lines) and columns (Bit-Lines). Physical Blocks contain multiple Logical Blocks and share common p-wells and Bit-Lines, impacting operation. Smaller Logical Blocks enable improved erase performance through parallelization. Understanding these processes and potential interruptions is crucial for designing reliable systems.
- Application NotePDF 710 KB AN502 Jan 24, 2024AI-generated Summary: Renesas NOR flash devices require decoupling capacitors close to VCC and GND pins to stabilize voltage, typically 1 μF with an optional 100 nF capacitor. Pull-up resistors are recommended on CS#, WP#/IO2, and HOLD#/IO3 pins to ensure proper signal states and facilitate debugging. Signal routing should minimize trace length and maintain a solid ground plane for high-speed signals. Power supply must rise monotonically during power-up. Basic system bring-up involves verifying installation, voltage levels, and SPI communication using manufacturer/device ID commands. Software drivers depend on host MCU architecture; Renesas offers example drivers and support. Correct erase/program sequences include write-enable, erase/program commands, and status checks. Tools for programming include flash loader plug-ins and debug probes. Switching from single to quad-SPI involves setting the quad-enable bit, changing pin functions. Dummy cycles introduce necessary wait times during read commands to accommodate latency.
Application Notes & White Papers (8)
- Product Change NoticePDF 195 KB Mar 06, 2023
- Product Change NoticePDF 528 KB Jun 26, 2020
Product Notices (PCN, EOL, etc) (5)
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- DocumentPDF 1 MB R10DS0315EU0000 Rev.0.00 Jun 28, 2022
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- Development ToolµISP is a compact standalone and universal solution, specifically designed for production environments, based on Algocrafts WriteNow! Technology. This is a standard tool for many families and devices and supports multi programming protocol (JTAG, SPI, UART, DAP, SWD, I2C, BDM, custom protocol, etc).Provided By: Algocraft Srl
- Development ToolWriteNow! Series of In-System Programmers is a breakthrough in the programming industry. The programmers support a large number of devices (microcontrollers, memories, CPLDs and other programmable devices) from various manufacturers and have a compact size for easy ATE/fixture integration. They work in standalone or connected to a ...Provided By: Algocraft Srl
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- Development ToolµISP is a compact standalone and universal solution, specifically designed for production environments, based on Algocrafts WriteNow! Technology. This is a standard tool for many families and devices and supports multi programming protocol (JTAG, SPI, UART, DAP, SWD, I2C, BDM, custom protocol, etc).Provided By: Algocraft Srl
- Development ToolWriteNow! Series of In-System Programmers is a breakthrough in the programming industry. The programmers support a large number of devices (microcontrollers, memories, CPLDs and other programmable devices) from various manufacturers and have a compact size for easy ATE/fixture integration. They work in standalone or connected to a ...Provided By: Algocraft Srl
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Support Communities
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DA14695 + QSPI Flash
Hi there, I want to use unsupported QSPI memory chip (Adesto AT25QL641). How can I do it? I assume that I need to write new flash driver, it is ok. As I know, tht memory ship differs from supported variants only by FastWrite (QSPI Write) command (another command code). Does ...
Apr 14, 2020 -
DA14695 + SEGGER Open Flashloader
... qspi.h, of target project (ble_adv example); 2. Open project segger_flash_loader, and edit FlashDev.c - change flash chip name and total size ("AT25QL641" - flash device name & 0x00800000 - total flash size) - see screenshot #1; 3. Build project segger_flash_loader at release configuration; 4. Update segger ...
Nov 11, 2021