| Title | Information |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | W8X8.64 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | WDC |
| Package Description Descriptive text for this package. | 8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan |
| Package Status | Active |
| Package Type | WLCSP-TCURDL |
| Class | PLASTIC |
| Package Code The unique identifier of this package. | WDC |
| Category | PLASTIC |
| Lead Count | 64 |
| Pb (Lead) Free | Yes |
| Length | 4.03mm |
| Width | 4.03mm |
| Thickness Seated height or Package height (Please check the outline drawing) | 0.6mm |
| Pitch | 0.5mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 4.03 x 4.03 x 0.60 |
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