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pkg_20133 (HSOP 8)

Title Information
Pkg. Name
Name used to describe Renesas packages.
PLSP0008DE-A
JEITA Standard
The JEITA standard to which the device is compliant.
P-LSOP8-4.4x5.2-1.27
Package Description
Descriptive text for this package.
Terminal Material - Base: Cu, Terminal Material - Pd-PPF
Package Status
Active
Package Type
HSOP
Class
Dic
Package Code
The unique identifier of this package.
pkg_20133
Lead Count
8
Pb (Lead) Free
Yes
Length
4.4mm
Width
5.2mm
Thickness
Seated height or Package height
(Please check the outline drawing)
1.8mm
Pitch
1.27mm
3D illustration featuring top and bottom views of HSOP IC chip package with 8 lead count.

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