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pkg_20026 (S-UFBGA 16)

Title Information
Pkg. Name
Name used to describe Renesas packages.
SUBG0016LB-A
JEITA Standard
The JEITA standard to which the device is compliant.
S-UFBGA16-1.84x1.87-0.40
Package Description
Descriptive text for this package.
Terminal Material - Base: Sn-Ag-Cu-Ni
Package Status
Active
Package Type
S-UFBGA
Class
IC
Package Code
The unique identifier of this package.
pkg_20026
Lead Count
16
Pb (Lead) Free
Yes
Length
1.87mm
Width
1.84mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0.4mm
Pitch
0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
1.87 x 1.84 x 0.4
3D illustration featuring top and bottom views of S-UFBGA chip package with 16 lead count.

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