| Title | Information |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
L23.2.6X3.5 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
LUU |
| Package Description Descriptive text for this package.
|
23 Lead, 2.6x3.5mm Flip Chip QFN (FCQFN) |
| Package Status | Active |
| Package Type | QFN |
| Package Code The unique identifier of this package.
|
LUU |
| Category | PLASTIC |
| Lead Count | 23 |
| Pb (Lead) Free | Yes |
| Length | 3.5mm |
| Width | 2.6mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0.85mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
3.50 x 2.60 x 0.85 |
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