Develop Highly Efficient X-in-1 Integrated Systems for EVs
Learn how to develop EV drive, charging, and battery management with a single RH850/U2B MCU chip.
Learn how to develop EV drive, charging, and battery management with a single RH850/U2B MCU chip.
The RL78/F25 is the first automotive MCU equipped with a capacitive sensing unit, supporting CAN FD and security to keep up with Electrical/Electronic (E/E) architecture trends.
Renesas delivers a secure, connected, and scalable Level 2 EV charging solution, empowering reliable, efficient charging for homes, workplaces, and light-commercial deployments.
RAA2S426x sensor signal conditioners address automotive industry challenges such as signal distortion, inaccurate readings, and prolonged development cycles, that compromise vehicle functionality and safety.
This executive blog shares insights from D.K Singh, VP of Engineering, Digitalization and Ted Pawela, VP and Head of Customer Success about how Renesas is driving innovation in the embedded systems space.
The Renesas Telematics Gateway Solution provides secure vehicle control, efficient zone control, and seamless OTA updates, empowering automakers to build reliable connected systems.
Hands-Off Detection (HOD) is a critical automotive technology to ensure safer, more efficient, and more convenient driving experiences. Renesas' RAA2S4704 impedance sensing IC is key to HOD systems.
This blog discusses the latest industry trends in the x-domain fusion architecture and a cost-effective solution for the entry mass market segment.
This blog discusses Renesas’ fifth generation (Gen 5) R-Car system-on-chip (SoC) for software-defined vehicle (SDV) design, the R-Car X5.
The blog discusses how Renesas' R-Car Gen 5 SoC facilitates the adoption of centralization and software defined vehicle (SDV), the new paradigm transforming the automotive E/E architecture.