Features
- Time synchronization accuracy between devices to less than ±1μs (CC-Link IE TSN Class B compatible)
- 2-port GbE compatible PHY, CPU and RAM (1.3MB) on a single chip
- Inherits protocol support from the R-IN engine
- Small size package and a built-in regulator for PHY reduces the mounting area
- Low power consumption (35% reduction vs. R-IN32M3-CL2)
Description
The R-IN32M4-CL3 ICs for industrial Ethernet communication support CC-Link IE TSN. With its built-in Gigabit Ethernet PHY and Renesas R-IN engine (“R-IN engine”) technology, the R-IN32M4-CL3 enables you to realize the latest Time-Sensitive Networking (TSN) technology on a single chip.
To support CC-Link IE TSN networks, the R-IN32M4-CL3 ICs for industrial Ethernet communication enables high-speed, high-precision motion control with time synchronization between devices that is precise to one-millionth of a second. This allows you to build applications with high-speed, high-precision motion control, accelerating TSN support by applications that require control with fast response time such as AC servos, actuators, and vision sensors, and remote I/O devices widely used in network communications.
Moreover, the key feature of the Renesas R-IN series (“R-IN series”), the built-in R-IN engine, offers fast real-time response and high-precision communication control (low jitter communication), which are important for Ethernet communication.
Applications
- Factory automation equipment
- Remote I/O
- Sensors
- Solenoid valves
- Motor networks
| Part Number | Status | Samples | Stock | Package | Budgetary Price (USD) | Lead Count (#) | Moisture Sensitivity Level (MSL) | I/O Ports | Pkg. Dimensions (mm) | Pb (Lead) Free | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| R9A06G064MGBG#AC0 | Last Time Buy | N/A | Out of Stock | BGA | 1ku | $17.67 | 484# | 3 | 106 | 23 x 23 x 2.03 | Yes | -40 to +85 | JAPAN | TAIWAN |
| R9A06G064MGBG#BC0 | Last Time Buy | Available | In Stock | BGA | 1ku | $14.72 | 484# | 3 | 106 | 23 x 23 x 2.03 | Yes | -40 to +85 | JAPAN | TAIWAN |
| R9A06G064SGBG#AC0 | Last Time Buy | N/A | In Stock | FBGA | 1ku | $16.4 | 356# | 3 | 101 | 17 x 17 x 2 | Yes | -40 to +85 | JAPAN | TAIWAN |
| R9A06G064SGBG#BC0 | Last Time Buy | N/A | In Stock | FBGA | 1ku | $13.72 | 356# | 3 | 101 | 17 x 17 x 2 | Yes | -40 to +85 | JAPAN | TAIWAN |
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- Application NoteThe R-IN32M4-CL3 Driver/Middleware package includes sample applications, libraries, middleware, and peripheral drivers essential for developing with the R-IN32M4-CL3 evaluation board. It supports CAN, CC-Link IE Field, TCP/IP stacks, and various timer and OS samples. The package organizes files into CMSIS, device-dependent folders, and project samples. It operates on the SBEV-RIN32M4CL3 and TS-TCS07908 boards using IAR Embedded Workbench and I-jet debuggers. Updates include TCP/IP stack improvements and new board support.Related Files:
- Application NoteDevelop a CC-Link IE TSN remote station using CC-Link IE TSN remote station communications LSI R-IN32M4-CL3. R-IN32M4-CL3 is an LSI that integrates the communications IP core for CC-Link IE TSN, CPU, and GbE-PHY.Related Files:
- Manual - Hardware
- Manual - Development Tools
- Manual - Development Tools
- Application NoteAI-generated Summary: The multi-protocol sample package provides software samples for industrial network protocol stacks including EtherNet/IP, PROFINET RT, Modbus TCP, and Modbus RTU/ASCII. It supports the R-IN32M4-CL3 evaluation board operating at 150 MHz and 3.3 V, using IAR Embedded Workbench for Arm and IAR I-jet emulator. The package includes separate zip files for each protocol stack sample program. Users can refer to individual sample program documents for detailed usage. The package folder structure organizes protocol samples and related manuals. No PCB design files such as BOM, schematics, or Gerber files are bundled within the sample program package.Related Files:
- Manual - Development Tools
- DatasheetRenesas R-IN32M4-CL3 DATA SHEET Rev.1.00RECOMMENDED
- Application NoteAI-generated Summary: Differences between R-IN32M4-CL2 and R-IN32M4-CL3 Ethernet communication LSIs focus on hardware and software changes required for replacement. Replacing CL2 with CL3 in CC-Link IE Field devices involves circuit modifications and driver updates, while replacing CL2 with CL3 in CC-Link IE TSN devices requires more extensive software changes due to different communication processes. Hardware differences include power supply, oscillator, regulator, A/D converter, buffer characteristics, pin assignments, and registers. Sample code adaptation varies depending on the replacement pattern, with some user program parts reusable and others requiring rewriting.
- Manual - Hardware
- Manual - Hardware
- Manual - Hardware
- DatasheetRenesas R-IN32M4-CL3 DATA SHEET Rev.1.00RECOMMENDED
Recommended Documents (1)
- DatasheetRenesas R-IN32M4-CL3 DATA SHEET Rev.1.00RECOMMENDED
Datasheets (1)
- Manual - Hardware
- Manual - Development Tools
- Manual - Development Tools
- Manual - Development ToolsView More (8)
Manuals & Guides (8)
- Application NoteThe R-IN32M4-CL3 Driver/Middleware package includes sample applications, libraries, middleware, and peripheral drivers essential for developing with the R-IN32M4-CL3 evaluation board. It supports CAN, CC-Link IE Field, TCP/IP stacks, and various timer and OS samples. The package organizes files into CMSIS, device-dependent folders, and project samples. It operates on the SBEV-RIN32M4CL3 and TS-TCS07908 boards using IAR Embedded Workbench and I-jet debuggers. Updates include TCP/IP stack improvements and new board support.Related Files:
- Application NoteDevelop a CC-Link IE TSN remote station using CC-Link IE TSN remote station communications LSI R-IN32M4-CL3. R-IN32M4-CL3 is an LSI that integrates the communications IP core for CC-Link IE TSN, CPU, and GbE-PHY.Related Files:
- Application NoteAI-generated Summary: The multi-protocol sample package provides software samples for industrial network protocol stacks including EtherNet/IP, PROFINET RT, Modbus TCP, and Modbus RTU/ASCII. It supports the R-IN32M4-CL3 evaluation board operating at 150 MHz and 3.3 V, using IAR Embedded Workbench for Arm and IAR I-jet emulator. The package includes separate zip files for each protocol stack sample program. Users can refer to individual sample program documents for detailed usage. The package folder structure organizes protocol samples and related manuals. No PCB design files such as BOM, schematics, or Gerber files are bundled within the sample program package.Related Files:
- Application NoteAI-generated Summary: Differences between R-IN32M4-CL2 and R-IN32M4-CL3 Ethernet communication LSIs focus on hardware and software changes required for replacement. Replacing CL2 with CL3 in CC-Link IE Field devices involves circuit modifications and driver updates, while replacing CL2 with CL3 in CC-Link IE TSN devices requires more extensive software changes due to different communication processes. Hardware differences include power supply, oscillator, regulator, A/D converter, buffer characteristics, pin assignments, and registers. Sample code adaptation varies depending on the replacement pattern, with some user program parts reusable and others requiring rewriting.
Application Notes & White Papers (4)
Product Notices (PCN, EOL, etc) (1)
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- Sample CodeRelated Files:
- Sample CodeUse this sample code to develop a CC-Link IE TSN remote station using CC-Link IE TSN remote station communications LSI R-IN32M4-CL3.Related Files:
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- Sample CodeUse this sample code to develop a CC-Link IE TSN remote station using CC-Link IE TSN remote station communications LSI R-IN32M4-CL3.Related Files:
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