The QS3VH245 HotSwitch 8-bit bus switch is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The switches can be turned ON under the control of the LVTTL-compatible Output Enable signal for bidirectional data flow with no added delay or ground bounce. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH245 ideal forhigh performance communications applications. The QS3VH245 operates from -40C to +85C.

特長

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 20 pin QSOP, SOIC, and TSSOP packages

製品選択

製品名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
QS3VH245PAG
Active TSSOP 20 C はい Tube
Availability
QS3VH245PAG8
Active TSSOP 20 C はい Reel
Availability
QS3VH245QG
Active QSOP 20 C はい Tube
Availability
QS3VH245QG8
Active QSOP 20 C はい Reel
Availability
QS3VH245SOG
Active SOIC 20 C はい Tube
Availability
QS3VH245SOG8
Active SOIC 20 C はい Reel
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
QS3VH245 Datasheet データシート PDF 340 KB
Errata LEN-08-01 エラッタ PDF 65 KB
ユーザーガイド、マニュアル
FCT Bus Switch Cross Reference Guide ガイド PDF 568 KB
アプリケーションノート、ホワイトペーパー
AN-20: Board Assembly for 0.4mm Pin Surface Mounts アプリケーションノート PDF 62 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 製品変更通知 PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 333 KB
PCN# : A1509-03 Gold to Copper wire 製品変更通知 PDF 31 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 製品変更通知 PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 製品変更通知 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 製品変更通知 PDF 110 KB
PCN# L0206-11 ICCQ Max Limit Change 製品変更通知 PDF 9 KB
PCN# G-0203-05 Mold Compound 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 製品変更通知 PDF 27 KB
PCN L0105-03: Die Revision 製品変更通知 PDF 11 KB
PCN# G0005-01, Laser Top Mark 製品変更通知 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 製品変更通知 PDF 44 KB
ダウンロード
QS3VH245 IBIS Model モデル-IBIS ZIP 9 KB
QS3VH245 Hspice Model モデル-HSPICE ZIP 18 KB