Surface-mount Type Gull Wing Lead Package Quad Lead QFP HQFP LQFP HLQFP TQFP HTQFP  
FQFP HFQFP LFQFP HLFQFP TFQFP HTFQFP PLCC
Dual Lead SOP HSOP MSOP HMSOP      
SSOP HSSOP LSSOP TSSOP HTSSOP    
TSOP(1) TSOP(2) SC70 SOT23 TSOT    
Non-lead Quad Lead VQFN HVQFN WQFN HWQFN HXQFN UQFN  
Dual Lead USON WSON HWSON HUSON XSON HXSON OSON
Area Array Ball BGA HBGA FBGA HFBGA LBGA LFBGA  
TFBGA VFBGA WLCSP        
Land TFLGA UFLGA VFLGA WFLGA XFLGA    
Module MODULE            
Through Hole Type DIP SDIP SIP HSIP ZIP    
Hermetic CAN CERDIP CFP CLCC CPGA CQFP  

Note: Package information is also found on the ordering tab of the detailed product page.

Symbol Meanings

Symbol The Meaning of the Symbols
H: Heat Sink with Heat Sink
L: Low Profile Maximum seated height, 1.2mm < L ≦ 1.7mm
T: Thin Maximum seated height, 1.0mm < T ≦1.2mm
V: Very Thin Maximum seated height, 0.8mm < V ≦1.0mm
W: Very Very Thin Maximum seated height, 0.65mm < W ≦0.8mm
U: Ultra Thin Maximum seated height, 0.5mm < U ≦0.65mm
X: Extremely Thin Maximum seated height, X ≦ 0.5mm
F: Fine Pitch Terminal pitch is 0.5mm or less. (only used for QFP)
Terminal pitch is 0.8mm or less. (only used for BGA, LGA)
S: Shrink Shrink pitch of basic package
(only used for SOP, DIP, ZIP, PGA)
O: Optical Uses optically clear mold compound for optical devices