The ISL6271A is a versatile power management IC (PMIC) designed for the Xscale type of processors. The device integrates three regulators, two fault indicators and an I2C bus for communication with a host microprocessor. Two of the three regulators function as low power, low drop out regulators, designed to power SRAM and phase-lock loop circuitry internal to the Xscale processor. The third regulator uses a proprietary switch-mode topology to power the processor core and facilitate Dynamic Voltage Management (DVM), as defined by Intel. Since power dissipation inside a microprocessor is proportional to the square of the core voltage, Intel XScale processors implement DVM as a means to more efficiently utilize battery capacity. To support this power saving architecture, the ISL6271A integrates an I2C bus for communication with the host processor. The processor, acting as the bus master, transmits a voltage level and voltage slew rate to the ISL6271A appropriate to the processing requirements; higher core voltages support higher operating frequencies and code execution. The bus is fully compliant with the Phillips® I2C protocol and supports both standard and fast data transmission modes. Alternatively, the output of the core regulator can be programmed in 50mV increments from 0. 85V to 1. 6V using the input Voltage ID (VID) pins. All three regulators share a common enable pin and are protected against overcurrent, over temperature and undervoltage conditions. When disabled via the enable pin, the ISL6271A enters a low power state that can be used to conserve battery life while maintaining the last programmed VID code and slew rate. An integrated soft-start circuit transitions the ISL6271A output voltages to their default values at a rate determined by an external soft-start capacitor.

Features

  • Three Voltage Regulators (1 Buck, 2 LDOs)
  • High-Efficiency, fully-Integrated synchronous buck regulator with DVM
  • 800mA DC output current for the buck regulator
  • Proprietary 'Synthetic Ripple' Control Topology
  • Greater than 1MHz Switching Frequency
  • Diode emulation for light load efficiency
  • I2C Interface Module for DVM from 0.85V to 1.6V
  • Optional fixed 4-bit VID-control in lieu of DVM
  • Small Output Inductor and Capacitor
  • Battery Fault signal
  • Input Supply Voltage Range: 2.76V-5.5V
  • 4x4 mm QFN Package: Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile
  • Pb-free Available (RoHS Compliant)

Applications

  • PDA
  • Cell Phone
  • Tablet Devices
  • Embedded Processors

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 75
Availability
Active QFN Reel 6000
Availability

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL6271A Datasheet Datasheet PDF 1012 KB
User Guides & Manuals
ISL6271AEVAL1 User Guide Manual PDF 1.07 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN14006 - Test Site Change for the Listed Intersil Products Product Change Notice PDF 168 KB
PCN13024 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL Product Change Notice PDF 183 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10083 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 79 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Downloads
ISL6271AEVAL1 Gerber Files Design File ZIP 46 KB
Other
Industrial Power Management Brochure ( R16CL0001EJ0200 ) 日本語 Brochure PDF 3.13 MB
ISL6271A Design Software Installer Library ZIP 1.13 MB
TB500: Computing Power Reference Design Adaptation Guide Other PDF 351 KB
TB501: Computing Power Regulator Layout Checklist Other PDF 366 KB
TB389: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Other PDF 958 KB
TB379: Thermal Characterization of Packaged Semiconductor Devices Other PDF 653 KB

Boards & Kits

Part Number Title Type Company
ISL6271AEVAL1 Integrated XScale Regulator Evaluation Board Evaluation Renesas