The ISL62883 is a multiphase PWM buck regulator for miroprocessor core power supply. The multiphase buck converter uses interleaved phase to reduce the total output voltage ripple with each phase carrying a portion of the total load current, providing better system performance, superior thermal management, lower component cost, reduced power dissipation, and smaller implementation area. The ISL62883 uses two integrated gate drivers and an external gate driver to provide a complete solution. The PWM modulator is based on Intersil's Robust Ripple Regulator (R3) technology™. Compared with traditional modulators, the R3™ modulator commands variable switching frequency during load transients, achieving faster transient response. With the same modulator, the switching frequency is reduced at light load, increasing the regulator efficiency. The ISL62883 is fully compliant with IMVP-6. 5™ specifications. It responds to PSI# and DPRSLPVR signals by adding or dropping PWM3 and Phase-2 respectively, adjusting overcurrent protection threshold accordingly, and entering/exiting diode emulation mode. It reports the regulator output current through the IMON pin. It senses the current by using either a discrete resistor or inductor DCR whose variation over temperature can be thermally compensated by a single NTC thermistor. It uses differential remote voltage sensing to accurately regulate the processor die voltage. The adaptive body diode conduction time reduction function minimizes the body diode conduction loss in diode emulation mode. User-selectable overshoot reduction function offers an option to aggressively reduce the output capacitors as well as the option to disable it for users concerned about increased system thermal stress. In 2-Phase configuration, the ISL62883 offers the FB2 function to optimize 1-Phase performance. The ISL62883B has the same functions as the ISL62883, but comes in a different package.

Features

  • Precision Multiphase Core Voltage Regulation
  • 0.5% System Accuracy Over-Temperature
  • Enhanced Load Line Accuracy
  • Microprocessor Voltage Identification Input
  • 7-Bit VID Input, 0.300V to 1.500V in 12.5mV Steps
  • Supports VID Changes On-The-Fly
  • Supports Multiple Current Sensing Methods
  • Lossless Inductor DCR Current Sensing
  • Precision Resistor Current Sensing
  • Supports PSI# and DPRSLPVR modes
  • Superior Noise Immunity and Transient Response
  • Current Monitor and Thermal Monitor
  • Differential Remote Voltage Sensing
  • High Efficiency Across Entire Load Range
  • Programmable 1-, 2- or 3-Phase Operation
  • Two Integrated Gate Drivers
  • Excellent Dynamic Current Balance Between Phases
  • FB2 Function in 2-Phase Configuration to Optimize 1-Phase Performance
  • Adaptive Body Diode Conduction Time Reduction
  • User-selectable Overshoot Reduction Function
  • Small Footprint 40 Ld 5x5 or 48 Ld 6x6 TQFN Package
  • Pb-Free (RoHS Compliant)

Applications

  • Notebook Computers

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active TQFN Tube 60
Availability
Active TQFN Reel 6000
Availability
Active TQFN Tube 60
Availability
Active TQFN Reel 6000
Availability

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL62883, ISL62883B Datasheet Datasheet PDF 2.16 MB
User Guides & Manuals
ISL8200MEVAL2PHZ User Guide Manual PDF 683 KB
ISL62883EVAL2Z User Guide Manual PDF 2.23 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN11030B - Data Sheet Electrical Specification Change for Intersil ISL62883* and ISL62883B* Products Product Change Notice PDF 149 KB
PCN11030 - Data Sheet Electrical Specification Change for Intersil ISL62883* and ISL62883B* Products Product Change Notice PDF 89 KB
PCN10099 - Alternate Manufacturing Site for the Listed Intersil TQFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 39 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Downloads
ISL62883EVAL2Z Design Files Design File ZIP 5.17 MB

Boards & Kits

Part Number Title Type Company
ISL62883CEVAL2Z Multiphase PWM Regulator Evaluation Board for IMVP-6.5™ Mobile CPUs Evaluation Renesas
ISL62883EVAL2Z Multiphase PWM Regulator Evaluation Board for IMVP-6.5™ Mobile CPUs Evaluation Renesas