The ISL6264 is a two-phase buck controller with embedded gate drivers. The two-phase buck controller uses two interleaved channels to effectively double the output voltage ripple frequency and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller real estate area. ISL6264 can also be configured as single-phase controller for low power CPU applications. The heart of the ISL6264 is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multi-phase buck regulator, the R3 Technology™ has the fastest transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. To boost battery life, the ISL6264 supports PSI_L for deeper sleep mode via automatically enabling different operation modes. At heavy load operation of the active mode, the regulator commands the two phase continuous conduction mode (CCM) operation. While the PSI_L is asserted during the deeper sleep mode, the ISL6264 smoothly disables one phase and operates in a one-phase diode emulation mode (DE) to maximize the efficiency at light load. A 6-bit digital-to-analog converter (DAC) allows dynamic adjustment of the core output voltage from 0. 375V to 1. 55V. A 0. 5% system accuracy of the core output voltage over temperature at active mode is achieved by the ISL6264. A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately measured and regulated per AMD mobile CPU specifications. Current sensing can be realized using either lossless inductor DCR sensing or precision resistor sensing. A single NTC thermistor network thermally compensates the gain and the time constant of the DCR variations.

Features

  • Precision Two-phase Core Voltage Regulator
  • 0.5% System Accuracy Over-temperature
  • Voltage Positioning with Adjustable Load Line and Offset
  • Internal Gate Driver with 2A Driving Capability
  • Dynamic Phase Adding/Dropping
  • Differential Current Sensing: DCR or Resistor
  • Microprocessor Voltage Identification Input
  • 6-Bit VID Input
  • 0.775V to 1.55V in 25mV Steps
  • 0.375V to 0.7625V in 12.5mV Steps
  • Adjustable Reference-Voltage Offset
  • Audio Filter Enable/Disable
  • User Programmable Switching Frequency
  • Differential Remote CPU Die Voltage Sensing
  • Static and Dynamic Current Sharing
  • Overvoltage, Undervoltage, and Overcurrent Protection
  • Pb-Free (RoHS Compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL6264 Datasheet Datasheet PDF 1.05 MB
User Guides & Manuals
ISL8200MEVAL2PHZ User Guide Manual PDF 683 KB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13060 - Test Site Change for the Listed Intersil Products Product Change Notice PDF 223 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB