Evaluation Kit for RA6M5 MCU Group
The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible...
The CK-RA6M5 cloud kit enables users to securely connect to the cloud and explore the features of the Cortex®-M33 based RA6M5 group of MCUs and cloud services. With multiple network connectivity options, the kit provides a seamless cloud connectivity experience to most of the global cloud service providers. It is equipped with an onboard Ethernet PHY for Ethernet connectivity. The kit is available with two options for wireless connectivity – Wi-Fi connectivity using DA16600 Wi-Fi-BLE combo module Pmod and cellular connectivity with RYZ014A LTE CAT-M1 module Pmod. With the Renesas Flexible Software Package (FSP), the kit has complete software stack support using FreeRTOS, Azure RTOS and other middleware stacks, thereby making it an ideal platform for efficiently developing cloud solutions and greatly reducing the time-to-market.
Visit Renesas Cloud Solutions for complete cloud solution package.
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Type | Title | Date |
Quick Start Guide | PDF 2.92 MB | |
Quick Start Guide | PDF 2.55 MB | |
Flyer | PDF 614 KB 日本語 | |
Quick Start Guide | PDF 3.42 MB | |
Application Note | PDF 4.52 MB | |
Quick Start Guide | PDF 2.90 MB | |
Manual - Development Tools | PDF 4.59 MB | |
Application Note | PDF 1.23 MB | |
Application Note | PDF 788 KB 日本語 | |
Application Note | PDF 2.74 MB | |
Application Note | PDF 3.24 MB | |
Application Note | PDF 3.75 MB 简体中文 | |
Application Note | PDF 1.02 MB | |
Application Note | PDF 672 KB | |
Manual - Development Tools | PDF 1.86 MB | |
Release Note | PDF 189 KB | |
Application Note | PDF 536 KB | |
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Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
Quick-Connect IoT Platform Quick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks.
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Other Hardware | Renesas |
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Sample Code | ZIP 4.11 MB | |
Sample Code | ZIP 12.89 MB | |
Sample Code |
[Software=RA FSP|v4.2.0]
ZIP
5.96 MB
Compiler:
GNUARM-None
IDE:
e2 studio
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Sample Code |
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
ZIP
11.82 MB
Compiler:
GNUARM-None
IDE:
e2 studio
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Sample Code |
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
ZIP
12.61 MB
Compiler:
GNUARM-None
IDE:
e2 studio
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Sample Code | ZIP 7.36 MB | |
Sample Code |
[Software=RA FSP|v4.2.0]
ZIP
6.07 MB
Compiler:
GNUARM-None
IDE:
e2 studio
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7 items
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The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible...
The US159-DA16600EVZ is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy Combo Pmod module that provides a convenient way to add both low power Wi-Fi...
Watch a short overview of the Renesas CK-RA6M5 and CK-RX-65N certified cellular-to-cloud IoT development kits to see how they can simplify solution prototyping for your next IoT design. Visit renesas.com/cloudsolutions to get started.
The IoT Cloud Connection Decision: Wi-Fi or Cellular? | Blog Post | Oct 31, 2023 | |
Empowering Designers to Connect to the Cloud Services of Their Choice | Blog Post | Apr 6, 2023 | |
Renesas Cellular-to-Cloud Development Kits Now Connect Seamlessly to Microsoft Azure Cloud Services | News | Apr 6, 2023 | |
Simplify Cellular-to-Cloud Development with the Renesas Cloud Kits CK-RA6M5 and CK-RX65N | Blog Post | Jun 15, 2022 | |
Renesas Launches Cellular-to-Cloud IoT Development Platforms Powered by RA and RX MCU Families | News | Jun 15, 2022 |