Cloud Kit Based on RA6M5 MCU Group
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Overview
Description
The CK-RA6M5 cloud kit enables users to securely connect to the cloud and explore the features of the Cortex®-M33 based RA6M5 group of MCUs and cloud services. With Renesas’ LTE Cellular CAT-M1 module RYZ014A and ethernet network connectivity options the kit provides a seamless cloud connectivity experience to most of the global cloud service providers. With Renesas Flexible Software Package (FSP) the kit has complete software stack support using FreeRTOS, Azure RTOS and other middleware stacks, thereby making it an ideal platform for efficiently developing cloud solutions and greatly reducing the time-to-market.
Visit Renesas Cloud Solutions for complete cloud solution package.
Kit Contents
- CK-RA6M5 v1 board
- RYZ014A PMOD (CAT-M1 Cellular Module)
- Micro USB to A cable
- Micro USB A/B to A adapter cable
- SIM card
- Antenna
Features
- Key Features
- LTE CAT-M1 with RYZ014A PMOD
- Ethernet
- USB Full Speed Host and Device
- Sensors:
- Humidity and Temperature
- Indoor Air Quality Index
- Outdoor Air Quality Index
- Heart rate, blood oxygen saturation (SpO2), respiration rate
- Barometric Pressure
- 9 axis Motion Tracking
- 2 MEMS Microphones
- Battery connector for portability
- Arduino™ (Uno R3) connector
- On-board MCU
- RF7A6M5BH3CFC microcontroller
- 200MHz, Arm® Cortex®-M33 core
- 2MB Code Flash, 512KB SRAM
- 176 pins, LQFP package
- Ecosystem
- MCU and Pmod current measurement points
- 5V input through USB or external power supply
- USB-serial converter
- Debug on-board (SEGGER J-Link)
- 4 user LEDS
- One user button
- 2 Digilent Pmod™ (SPI/UART/I2C: Type-6A and Type-2A) connectors
Applications
Documentation
| Document title | Document type
|
Date Date | |
|---|---|---|---|
| PDF 1.42 MB | Quick Start Guide | ||
| PDF 1.23 MB | Application Note | ||
| PDF 788 KB 日本語 | Application Note | ||
| PDF 2.74 MB | Application Note | ||
| PDF 3.24 MB | Application Note | ||
| PDF 3.75 MB 简体中文 | Application Note | ||
| PDF 1.02 MB | Application Note | ||
| PDF 672 KB | Application Note | ||
| PDF 536 KB | Application Note | ||
| PDF 761 KB 日本語 | Flyer | ||
| PDF 4.59 MB | Manual - Development Tools | ||
| PDF 1.86 MB | Manual - Development Tools | ||
| PDF 2.55 MB | Quick Start Guide | ||
| PDF 189 KB | Release Note | ||
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Design & Development
Software & Tools
Software & Tools
| Software title
|
Software type
|
Company
|
|---|---|---|
| Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required.
|
Software Package | Renesas |
| Quick-Connect IoT Platform Quick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks.
|
Other Hardware | Renesas |
2 items
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Sample Code
Sample Code
Filters
|
|||
|---|---|---|---|
| Title | Type | Date Date | |
|
[Software=RA FSP|v4.2.0]
ZIP
5.96 MB
Compiler:
GNUARM-None
IDE:
e2 studio
|
Sample Code | ||
|
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
ZIP
11.82 MB
Compiler:
GNUARM-None
IDE:
e2 studio
|
Sample Code | ||
|
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
ZIP
12.61 MB
Compiler:
GNUARM-None
IDE:
e2 studio
|
Sample Code | ||
| ZIP 7.36 MB | Sample Code | ||
|
[Software=RA FSP|v4.2.0]
ZIP
6.07 MB
Compiler:
GNUARM-None
IDE:
e2 studio
|
Sample Code | ||
5 items
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Support
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Cellular-to-Cloud Development Kits
Watch a short overview of the Renesas CK-RA6M5 and CK-RX-65N certified cellular-to-cloud IoT development kits to see how they can simplify solution prototyping for your next IoT design. Visit renesas.com/cloudsolutions to get started.
Video List
