Overview

Description

The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same.

Applications

Applications

  • Electronic Household Appliances
  • Office Equipment
  • Audio Equipment
  • Consumer Products
  • Automotive

Documentation

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Datasheet
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Brochure
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Brochure
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End Of Life Notice
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General Reliability Literature
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Guide
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Guide
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Guide
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Guide
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Guide
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Manual - Development Tools
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PDF4.86 MB日本語
Product Change Notice
PDF3.74 MB日本語
Product Change Notice
PDF1.46 MB日本語
Product Change Notice
PDF663 KB日本語
Quick Start Guide
PDF371 KB日本語
Quick Start Guide
PDF307 KB日本語
Release Note
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